Thermal/Mechanical Specifications and Design Guidelines
97
Package Mechanical Drawings
§
Figure D-2. Processor Package Drawing (Sheet 2 of 2)
.
H
G
F
E
D
C
B
A
H
G
F
E
D
C
B
A
8 7 6 5
4 3 2
8 7 6 5
4 3 2
1
H
G
F
H
F
H
G
C
T 1
T 2
V 1
V 2
19.68
11.95
9.84
5.975
R1
R2
1.06
MAX ALLOWABLE
COMPONENT HEIGHT
THIS DRAWING CONTAINS INTEL CORPORAT
ION CONFIDENTIAL INFORMATION. IT IS
DISCLOSED IN CONFIDENCE AND ITS CONT
ENTS
MAY NOT BE DISCLOSED, REPRODUCED, DI
SPLAYED OR MODIFIED, WITHOUT THE PRI
OR WRITTEN CONSENT OF INTEL CORPORAT
ION.
E22526
2
6
DWG. NO
SHT.
REV
DEPARTMENT
R
2200 MISSION COLLEGE BLVD. P.O. BOX 58119 SANTA CLARA, CA 95052-8119
SIZE
DRAWING NUMBER
REV
A1
E22526
6
SCALE:
6
DO NOT SCALE DRAWING
SHEET
2
OF
2
D
E
0.23
C
F
H
JK
J
K
DETAIL
D
SCALE
20
0.23
C
G
H
MN
N
M
DETAIL
E
SCALE
20
SYMBOL
MILLIMETERS
COMMENTS
MIN
MAX
R 1
R1.09 BASIC
R 2
R1.09 BASIC
T 1
9.75 BASIC
T 2
0.2 BASIC
V 1
9.75 BASIC
V 2
0.2 BASIC
Summary of Contents for i5-700
Page 30: ...Independent Loading Mechanism ILM 30 Thermal Mechanical Specifications and Design Guidelines...
Page 88: ...Mechanical Drawings 88 Thermal Mechanical Specifications and Design Guidelines...
Page 94: ...Socket Mechanical Drawings 94 Thermal Mechanical Specifications and Design Guidelines...
Page 98: ...Package Mechanical Drawings 98 Thermal Mechanical Specifications and Design Guidelines...
Page 102: ...Heat Sink Back Plate Drawings 102 Thermal Mechanical Specifications and Design Guidelines...
