Intel
®
Pentium
®
III Processor in the FC-PGA2 Package Thermal Design Guidelines
R
249660-001
11
3. FC-PGA2
Processor
Packaging
Technology
The Intel
®
Pentium
®
III
processor is available in Flip Chip Pin Grid Array 2 (FC-PGA2) packaging. The
FC-PGA2 package consists of the microprocessor silicon core with integrated L2 cache mounted on a
pinned substrate. The silicon core is encased by a heat spreader, which is integrally mounted to the FC-
PGA2 substrate. The Integrated Heat Spreader (IHS) is designed to improve thermal performance and is
the interface for attaching a heatsink. The processor core is mounted with the back of the die facing up,
hence the term “flip chip.” The pin grid array on the backside of the interposer is not fully populated and
there may be small, low power, surface mounted components in the center of the pin field. The processor
package connects to the motherboard by plugging into a 370-pin ZIF socket (PGA370). See Figure
3-1and Table 3-1 (
below
) for a complete mechanical dimensioning. A description of the socket can be
found in the
370-Pin Socket (PGA370) Design Guidelines
. Refer to the processor datasheets for package
mechanical loading specifications.
Figure 3-1. FC-PGA2 Mechanical Specifications
