11
1
Product Description
1.1
Overview
1.1.1
Feature Summary
Table 1 summarizes the major features of the board.
Table 1. Feature Summary
Form Factor
MicroATX (9.60 inches by 9.60 inches [243.84 millimeters by
243.84 millimeters])
Processor
•
3
rd
generation Intel
®
Core processor family and 2
nd
generation Intel
®
Core
processor family processors with up to 95 W TDP in an LGA1155 socket
―
One PCI Express* x16 graphics interface
―
Integrated memory controller with dual channel DDR3 memory support
―
Integrated graphics processing (processors with Intel
®
HD Graphics)
―
External graphics interface controller
Memory
•
Four 240-pin DDR3 SDRAM Dual Inline Memory Module (DIMM) sockets
•
Support for DDR3 1600 MHz, DDR3 1333 MHz, and DDR3 1066 MHz DIMMs
•
Support for 1 Gb, 2 Gb, and 4 Gb memory technology
•
Support for up to 32 GB of system memory with four DIMMs using 4 Gb
memory technology
•
Support for non-ECC memory
•
Support for 1.5 V (standard voltage) and 1.35 V (low voltage) JEDEC memory
•
Support for XMP memory
Note: DDR3 1600 MHz DIMMs are only supported by 3
rd
generation Intel Core
processor family processors
Chipset
Intel
®
H77 Express Chipset consisting of the Intel
®
H77 Express Platform
Controller Hub (PCH)
Graphics
•
Integrated graphics support for processors with Intel HD Graphics:
―
High Definition Multimedia Interface* (HDMI*) v1.4a
―
DVI-I v1.0
―
DisplayPort* v1.1a
•
Support for a PCI Express* 3.0 x16 add-in graphics card
Note: PCI Express 3.0 is only supported by 3
rd
generation Intel Core
processor family processors
Audio
•
10-channel (8 + 2) Intel High Definition Audio via the Realtek* ALC892 audio
codec
continued