Intel
®
Celeron
®
D Processor in the 775-Land LGA Package
Thermal Design Guide
13
Order #
303730
Processor Thermal/Mechanical Information
To determine compliance to the thermal profile, a measurement of the actual processor power
dissipated is required. The measured power is plotted on the Thermal Profile to determine the
maximum case temperature. Using the example in
, a power dissipation of 70 W has a case
temperature of 61 °C. Contact your Intel sales representative for assistance in processor power
measurement.
For the Intel Celeron D Processor in the 775-Land LGA Package, there are two thermal profiles to
consider. The Platform Requirement Bit (PRB) indicates which thermal profile is appropriate for a
specific processor. This document will focus on the development of thermal solutions to meet the
thermal profile for PRB=1. See the processor datasheet for the thermal profile and additional
discussion on the PRB.
2.2.3
T
CONTROL
.
T
CONTROL
defines the maximum operating temperature for the on-die thermal diode when the
thermal solution fan speed is being controlled by the on-die thermal diode. The T
CONTROL
parameter
defines a very specific processor operating region where the T
C
is not specified. This parameter
allows the system integrator a method to reduce the acoustic noise of the processor cooling
solution, while maintaining compliance to the processor thermal specification.
The value of T
CONTROL
is driven by a number of factors. One of the most significant of these is the
processor idle power. As a result a processor with a high T
CONTROL
will dissipate more power than a
part with lower value of T
CONTROL
when running the same application.
The value of T
CONTROL
is calculated such that regardless of the individual processor’s T
CONTROL
value the thermal solution should perform similarly. The higher leakage of some parts is offset by a
higher value of T
CONTROL
in such a way that they will behave virtually the same acoustically
Figure 3. Example Thermal Profile
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75
30
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110
Watts
C
as
e T
e
m
p
er
at
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re
(
C
)
Thermal Profile
FMB2
Heatsink
Design Point
