Thermal/Mechanical Specifications and Design Guide
43
Thermal Management Specifications
6
Thermal Management
Specifications
6.1
Package Thermal Specifications
The processor requires a thermal solution to maintain temperatures within operating
limits. Any attempt to operate the processor outside these limits may result in
permanent damage to the processor and potentially other components within the
system. Maintaining the proper thermal environment is key to reliable, long-term
system operation.
A complete solution includes both component and system level thermal management
features. Component level thermal solutions can include active or passive heatsinks
attached to the processor integrated heat spreader (IHS). Typical system level thermal
solutions may consist of system fans combined with ducting and venting.
This section provides data necessary for developing a complete thermal solution. For
more information on the reference thermal solution and designing a component level
thermal solution, refer to
Note:
The boxed processor will ship with a component thermal solution.
6.1.1
Thermal Specifications
To allow optimal operation and long-term reliability of Intel processor-based systems,
the processor must remain within the minimum and maximum case temperature
(T
CASE
) specifications as defined by the applicable thermal profile. Thermal solutions
not designed to provide sufficient thermal capability may affect the long-term reliability
of the processor and system.
The Intel
®
Core™ i7-3960X, i7-3970X processor Extreme Edition, Intel
®
Core™ i7-
3930K processor, and Intel
®
Core™ i7-3820 processor implement a methodology for
managing processor temperatures which is intended to support acoustic noise
reduction through fan speed control and to assure processor reliability. Selection of the
appropriate fan speed is based on the relative temperature data reported by the
processor’s Platform Environment Control Interface (PECI) as described in
.
The temperature reported over PECI is always a negative value and represents a delta
below the onset of thermal control circuit (TCC) activation, as indicated by the
PROCHOT# signal. Systems that implement fan speed control must be designed to use
this data.
Intel recommends that complete thermal solution designs target the Thermal Design
Power (TDP). The Adaptive Thermal Monitor feature is intended to help protect the
processor in the event that an application exceeds the TDP recommendation for a
sustained time period.
The Adaptive Thermal Monitor feature must be enabled
for the processor to remain within its specifications.
Summary of Contents for BX80619I73820
Page 10: ...10 Thermal Mechanical Specifications and Design Guide...
Page 14: ...Introduction 14 Thermal Mechanical Specifications and Design Guide...
Page 104: ...Thermal Solutions 104 Thermal Mechanical Specifications and Design Guide...
Page 112: ...Mechanical Drawings 112 Thermal Mechanical Specifications and Design Guide...
Page 118: ...Socket Mechanical Drawings 118 Thermal Mechanical Specifications and Design Guide...
Page 124: ...Package Mechanical Drawings 124 Thermal Mechanical Specifications and Design Guide...
