Thermal/Mechanical Specifications and Design Guide
17
Package Mechanical Specifications
2.1.3
Package Loading Specifications
provides load specifications for the processor package. These maximum
limits should not be exceeded during heatsink assembly, shipping conditions, or
standard use condition. Exceeding these limits during test may result in component
failure. The processor substrate should not be used as a mechanical reference or load-
bearing surface for thermal solutions.
.
Notes:
1.
These specifications apply to uniform compressive loading in a direction normal to the processor IHS.
2.
This is the maximum static force that can be applied by the heatsink and Independent Loading Mechanism
(ILM).
3.
These specifications are based on limited testing for design characterization. Loading limits are for the
package constrained by the limits of the processor socket.
4.
Dynamic loading is defined the maximum heatsink mass from
with an 11 ms duration average
load superimposed on the static load requirement.
5.
See Section 5.3 for minimum socket load to engage processor within socket.
2.1.4
Package Handling Guidelines
includes a list of guidelines on package handling in terms of recommended
maximum loading on the processor IHS relative to a fixed substrate. These package
handling loads may be experienced during heatsink removal.
2.1.5
Package Insertion Specifications
The processor can be inserted into and removed from an LGA2011-0 socket 15 times.
The socket should meet the LGA2011-0 requirements detailed in
and
.
2.1.6
Processor Mass Specification
The typical mass of the processor is currently 45 grams. This mass [weight] includes all
the components that are included in the package.
Table 2-1.
Processor Loading Specifications
Parameter
Maximum
Notes
Static Compressive Load
1067 N [240 lbf]
1, 2, 3, 5
Dynamic Load
589 N [132 lbf]
1, 3, 4, 5
Table 2-2.
Package Handling Guidelines
Parameter
Maximum Recommended
Notes
Shear
80 lbs (36.287 kg)
Tensile
35 lbs (15.875 kg)
Torque
35 in.lbs (15.875 kg-cm)
Summary of Contents for BX80619I73820
Page 10: ...10 Thermal Mechanical Specifications and Design Guide...
Page 14: ...Introduction 14 Thermal Mechanical Specifications and Design Guide...
Page 104: ...Thermal Solutions 104 Thermal Mechanical Specifications and Design Guide...
Page 112: ...Mechanical Drawings 112 Thermal Mechanical Specifications and Design Guide...
Page 118: ...Socket Mechanical Drawings 118 Thermal Mechanical Specifications and Design Guide...
Page 124: ...Package Mechanical Drawings 124 Thermal Mechanical Specifications and Design Guide...
