CPU Thermal Solution (Heatsink) Installation
Development Kit User’s Manual
79
4.
Place the backplate on the underside of the development board so that the
pins protrude through the holes in the development board around the
processor. (See the figure below.) Be sure to orient the backplate so that it
does not contact any of the decoupling capacitors. The backplate is cut out on
one side to allow this.
Figure 25. Step 4 - Backplate Pins
5.
Clean the die of the processor with isopropyl alcohol before the heatsink is
attached to the processor. This ensures that the surface of the die is clean.
