Technical Reference
63
Table 30 provides maximum case temperatures for the components that are sensitive
to thermal changes. The operating temperature, current load, or operating frequency
could affect case temperatures. Maximum case temperatures are important when
considering proper airflow to cool the board.
Table 30. Thermal Considerations for Components
Component
Maximum Case Temperature
Processor
For processor case temperature, see processor datasheets and
processor specification updates
Intel 82945G GMCH
99
o
C (under bias)
Intel 82801GB ICH7
110
o
C (under bias, without heatsink)
99
o
C (under bias, with heatsink)
For information about
Refer to
Processor datasheets and specification updates
Section 1.2, page 15
2.12
Reliability
The Mean Time Between Failures (MTBF) prediction is calculated using component and
subassembly random failure rates. The calculation is based on the Bellcore Reliability
Prediction Procedure, TR-NWT-000332, Issue 4, September 1991. The MTBF
prediction is used to estimate repair rates and spare parts requirements.
The MTBF data is calculated from predicted data at 55 ºC. The MTBF for the D945GCL
board is 108,165 hours.
