Balanced Technology Extended (BTX) Thermal/Mechanical Design Information
Thermal and Mechanical Design Guidelines
39
5
Balanced Technology Extended
(BTX) Thermal/Mechanical
Design Information
5.1
Overview of the BTX Reference Design
The reference thermal module assembly is a Type II BTX compliant design and is
compliant with the reference BTX motherboard keep-out and height recommendations
defined in Section 6.6.
The solution comes as an integrated assembly. An isometric view of the assembly is
provided in Figure 5-4.
5.1.1
Target Heatsink Performance
Table 5–1 provides the target heatsink performance for the processor with the BTX
boundary conditions. The results will be evaluated using the test procedure described
in Section 5.2.
The table also includes a T
A
assumption of 35.5 °C for the Intel reference thermal
solution at the processor fan heatsink inlet discussed in Section 3.3. The analysis
assumes a uniform 35 °C external ambient temperature to the chassis of across the
fan inlet, resulting in a temperature rise, T
R
, of 0.5 °C. Meeting T
A
and
Ψ
CA
targets can
maximize processor performance (refer to Sections 2.2, 2.4. and Chapter 4).
Minimizing T
R
can lead to improved acoustics.
Table 5–1. Balanced Technology Extended (BTX) Type II Reference TMA Performance
Processor
Thermal
Requirements,
Ψ
ca
(Mean + 3
σ
)
T
A
Assumption
Notes
Intel Core™2 Duo processor E8000
series with 6 MB cache
0.57
°
C/W
35.5
°
C
1,2,3
Intel Core™2 Duo processor E7000
series with 3 MB cache /Intel Pentium
®
dual-core processor
E6000,
E5000 series
with 2 MB cache /
Intel
®
Celeron
®
processor E3000 series with 1 MB cache
0.594
°
C/W
35.5
°
C
1,2,3
NOTES:
1.
Performance targets (Ψ ca) as measured with a live processor at TDP.
2.
The difference in Ψ ca between the Intel Core™2 Duo processor E8000 series with
6 MB cache, Intel Core™2 Duo processor E7000 series with 3 MB cache, Intel Pentium
®
dual-core processor E6000, E5000 series with 2 MB cache, and Intel
®
Celeron
®
processor E3000 series is due to a slight difference in the die size.
3.
This data is pre-silicon data, and subject to change with the post silicon validate
results.
Summary of Contents for AT80569PJ080N - Core 2 Quad 3 GHz Processor
Page 24: ...Processor Thermal Mechanical Information 24 Thermal and Mechanical Design Guidelines...
Page 80: ...Heatsink Clip Load Metrology 80 Thermal and Mechanical Design Guidelines...
Page 82: ...Thermal Interface Management 82 Thermal and Mechanical Design Guidelines...
Page 108: ...Fan Performance for Reference Design 108 Thermal and Mechanical Design Guidelines...
