Case Temperature Reference Metrology
R
Thermal/Mechanical Design Guide
85
18.
Use a blade to carefully shave excess adhesive above the IHS surface (Figure 39).
Note:
Take usual safety precautions when using open blades and performing this operation.
Figure 39. Removing Excess Adhesive from IHS
19.
Install new Kapton tape to hold the thermocouple wire down and fill the rest of the groove
with adhesive (see Figure 40). Make sure the wire and insulation is entirely within the groove
and below the IHS surface.
Figure 40. Filling the Groove with Adhesive
Kapton* Tape
Filling with
Adhesive
20.
Curing time for the rest of the adhesive in the groove can be reduced using Loctite
Accelerator 7452.
21.
Repeat step 5 to remove any access adhesive to ensure flat IHS for proper mechanical contact
to the heatsink surface.
Summary of Contents for 640 - Pentium 4 640 3.2GHz 800MHz 2MB Socket 775 CPU
Page 14: ...Introduction R 14 Thermal Mechanical Design Guide ...
Page 38: ...Thermal Management Logic and Thermal Monitor Feature R 38 Thermal Mechanical Design Guide ...
Page 52: ...Intel Thermal Mechanical Reference Design Information R 52 Thermal Mechanical Design Guide ...
Page 60: ...Acoustic Fan Speed Control R 60 Thermal Mechanical Design Guide ...
Page 72: ...Heatsink Clip Load Metrology R 72 Thermal Mechanical Design Guide ...
Page 99: ...Mechanical Drawings R Thermal Mechanical Design Guide 99 Figure 50 Reference Fastener Sheet 1 ...
Page 103: ...Mechanical Drawings R Thermal Mechanical Design Guide 103 Figure 54 Clip Heatsink Assembly ...
