LGA775 Socket Heatsink Loading
R
66
Thermal/Mechanical Design Guide
A.3
Heatsink Selection Guidelines
Evaluate carefully heatsinks that use motherboard stiffening devices (like backing plates), and
conduct board deflection assessments based on the board deflection metric.
Solutions derived from the reference design comply with the reference heatsink preload, for
example:
•
The Intel Boxed Pentium 4 Processor in the 775–land LGA package.
•
The Intel RCBFH-3 Reference Design available from licensed suppliers (refer to
Appendix H for contact information).
Intel is also collaborating with vendors participating in its third party test house program to
evaluate third party solutions. Vendor information will be available and updated regularly after
product launch at http://developer.intel.com. After selecting the processor, go to the processor
technical information page, and then select “Support component”.
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Summary of Contents for 640 - Pentium 4 640 3.2GHz 800MHz 2MB Socket 775 CPU
Page 14: ...Introduction R 14 Thermal Mechanical Design Guide ...
Page 38: ...Thermal Management Logic and Thermal Monitor Feature R 38 Thermal Mechanical Design Guide ...
Page 52: ...Intel Thermal Mechanical Reference Design Information R 52 Thermal Mechanical Design Guide ...
Page 60: ...Acoustic Fan Speed Control R 60 Thermal Mechanical Design Guide ...
Page 72: ...Heatsink Clip Load Metrology R 72 Thermal Mechanical Design Guide ...
Page 99: ...Mechanical Drawings R Thermal Mechanical Design Guide 99 Figure 50 Reference Fastener Sheet 1 ...
Page 103: ...Mechanical Drawings R Thermal Mechanical Design Guide 103 Figure 54 Clip Heatsink Assembly ...
