Intel 500 - DATASHEET REV 003, Datasheet, Page: 61 / 67

Datasheet 61
Thermal Specifications
5 Thermal Specifications
A complete thermal solution includes both component and system level thermal
management features. The processor requires a thermal solution to maintain
temperatures within operating limits.
Caution: Any attempt to operate the processor outside operating limits may result in permanent
damage to the processor and potentially other components in the system.
The system/processor thermal solution should remain within the minimum and
maximum junction temperature (Tj) specifications at the corresponding thermal design
power (TDP) value listed in Table 16 .
NOTES:
1.
The TDP specification should be used to design the processor thermal solution. The TDP is
not the maximum theoretical power the processor can generate.
2. Not 100% tested. These power specifications are determined by characterization of the
processor currents at higher temperatures and extrapolating the values for the
temperature indicated.
3. As measured by the activation of the on-die Intel® Thermal Monitor. The Intel Thermal
Monitor’s automatic mode is used to indicate that the maximum T
J
has been reached.
Refer to Section 5.1 for more details.
4. The Intel Thermal Monitor automatic mode must be enabled for the processor to operate
within specifications.
5. At Tj of 100 ° C.
6. At 50°C.
7. At 35°C.
Table 16. Standard Voltage Power Specifications
Symbol
Processor
Number
Core Frequency
and Voltage
Die Variant
Thermal Design
Power
Unit Notes
TDP
530
540
550
560
1.73 GHz
1.86 GHz
2.00 GHz
2.13 GHz
1-M Fused
1 M
1-M Fused
1 M
1-M Fused
1 M
1-M Fused
1M
31
27
31
27
31
27
31
27
W 1, 4, 5
Symbol Parameter Min Typ Max Unit
P
AH,
P
SGNT
Auto Halt, Stop Grant Power at V
CC
10.9 W 2, 6
P
SLP
Sleep Power at V
CC
10.1 W 2, 6
P
DSLP
Deep Sleep Power at V
CC
6.8 W 2, 7
T
J
Junction Temperature 0 100 ° C 3, 4