Intel® 3210 and 3200 Chipset Thermal/Mechanical Design Guide
37
Reference Thermal Solution
6.4.1
Extruded Heatsink Profiles
The reference thermal solution uses an extruded heatsink for cooling the chipset MCH.
shows the heatsink profile. Other heatsinks with similar dimensions and
increased thermal performance may be available. A full mechanical drawing of this
heatsink is provided in
.
Figure 6-2. Design Concept for Reference Thermal Solution
Figure 6-3. Heatsink Extrusion Profiles
Summary of Contents for 3200
Page 6: ...6 Intel 3210 and 3200 Chipset Thermal Mechanical Design Guide ...
Page 10: ...Introduction 10 Intel 3210 and 3200 Chipset Thermal Mechanical Design Guide ...
Page 16: ...Thermal Specifications 16 Intel 3210 and 3200 Chipset Thermal Mechanical Design Guide ...
Page 18: ...Thermal Simulation 18 Intel 3210 and 3200 Chipset Thermal Mechanical Design Guide ...
Page 42: ...Reference Thermal Solution 42 Intel 3210 and 3200 Chipset Thermal Mechanical Design Guide ...
