20080908
1-12-1
E5H55EL
ELECTRICAL PARTS LIST
PRODUCT SAFETY NOTE:
Products marked with a
#
have special characteristics important to safety.
Before replacing any of these components, read
carefully the product safety notice in this service
manual. Don't degrade the safety of the product
through improper servicing.
NOTES:
1. Parts that are not assigned part numbers (---------)
are not available.
2. Tolerance of Capacitors and Resistors are noted
with the following symbols.
FE MAIN CBA & BD MECHANISM
ASSEMBLY
BE MAIN CBA UNIT
AV ASSEMBLY
AV CBA
C.....±0.25%
D.....±0.5%
F.....±1%
G.....±2%
J......±5%
K.....±10%
M.....±20%
N.....±30%
Z.....+80/-20%
Ref. No.
Description
Part No.
FE MAIN CBA & BD MECHANISM ASSEMBLY
N7JR0AUN
Ref. No.
Description
Part No.
BE MAIN CBA UNIT
1VSA20044
Ref. No.
Description
Part No.
AV ASSEMBLY
Consists of the following:
1VSA20064
AV CBA
POWER SW CBA
FRONT CBA
----------
----------
----------
Ref. No.
Description
Part No.
AV CBA
Consists of the following:
----------
CAPACITORS
C2000
CHIP CERAMIC CAP.(1608) B K 0.1
µ
F/25V
CHD1EK30B104
C2001
ELECTROLYTIC CAP. 100
µ
F/16V M
CE1CMASDL101
C2004
ELECTROLYTIC CAP. 47
µ
F/16V M
CE1CMASDL470
C2005
CHIP CERAMIC CAP.(1608) F Z 0.1
µ
F/50V
CHD1JZ30F104
C2007
CHIP CERAMIC CAP.(1608) F Z 0.1
µ
F/50V
CHD1JZ30F104
C2009
CHIP CERAMIC CAP.(1608) CH J 100pF/50V
CHD1JJ3CH101
C2011
CHIP CERAMIC CAP.(1608) F Z 0.1
µ
F/50V
CHD1JZ30F104
C2012
CHIP CERAMIC CAP.(1608) CH J 100pF/50V
CHD1JJ3CH101
If C2013 is 0.1
µ
F, then IC2001 is PST3630NR.
C2013
CHIP CERAMIC CAP.(1608) B K 0.1
µ
F/25V
CHD1EK30B104
IC2001
RESET IC PST3630NR
QSZBA0TMM180
If C2013 is 0.01
µ
F, then IC2001 is PST8430NR.
C2013
CHIP CERAMIC CAP.(1608) B K 0.01
µ
F/50V
CHD1JK30B103
IC2001
RESET IC PST8430NR
QSZBA0TMM203
C2015
CHIP CERAMIC CAP. (1608) B K 1
µ
F/16V
CHD1CK30B105
C2016
ELECTROLYTIC CAP. 22
µ
F/6.3V M
CE0KMASDL220
C2018
ELECTROLYTIC CAP. 47
µ
F/6.3V M
CE0KMASDL470
C2019
CHIP RES.(1608) 1/10W 0
Ω
RRXAZR5Z0000
C2100
CHIP CERAMIC CAP.(1608) B K 0.1
µ
F/25V
CHD1EK30B104
C2104
ELECTROLYTIC CAP. 47
µ
F/6.3V M
CE0KMASDL470
C2106
CHIP CERAMIC CAP. CH D 8pF/50V
CHD1JD3CH8R0
C2107
ELECTROLYTIC CAP. 220
µ
F/6.3V M
CE0KMASDL221
C2108
CHIP CERAMIC CAP.(1608) F Z 0.1
µ
F/50V
CHD1JZ30F104
C2180
CHIP CERAMIC CAP.(1608) F Z 0.1
µ
F/50V
CHD1JZ30F104
C2181
ELECTROLYTIC CAP. 220
µ
F/6.3V M
CE0KMASDL221
C2204
ELECTROLYTIC CAP. 47
µ
F/25V M
CE1EMASDL470
C2205
ELECTROLYTIC CAP. 470
µ
F/6.3V M
CE0KMASDL471
C2206
CHIP CERAMIC CAP.(1608) F Z 0.1
µ
F/50V
CHD1JZ30F104
C2207
ELECTROLYTIC CAP. 10
µ
F/16V M
CE1CMASDL100
C2208
ELECTROLYTIC CAP. 10
µ
F/16V M
CE1CMASDL100
C2209
CHIP CERAMIC CAP. CH J 220pF/50V
CHD1JJ3CH221
C2210
CHIP CERAMIC CAP. CH J 220pF/50V
CHD1JJ3CH221
C2211
ELECTROLYTIC CAP. 10
µ
F/16V M
CE1CMASDL100
C2212
ELECTROLYTIC CAP. 10
µ
F/16V M
CE1CMASDL100
C2213
CHIP CERAMIC CAP.(1608) F Z 0.1
µ
F/50V
CHD1JZ30F104
C2215
CHIP CERAMIC CAP. CH J 39pF/50V
CHD1JJ3CH390
C2216
CHIP CERAMIC CAP. CH J 39pF/50V
CHD1JJ3CH390
C2280
CHIP CERAMIC CAP.(1608) F Z 0.1
µ
F/50V
CHD1JZ30F104
C2281
ELECTROLYTIC CAP. 220
µ
F/6.3V M
CE0KMASDL221
C2282
ELECTROLYTIC CAP. 100
µ
F/16V M
CE1CMASDL101
C2283
ELECTROLYTIC CAP. 1000
µ
F/6.3V M
CE0KMASDL102
C2284
CHIP CERAMIC CAP.(1608) F Z 0.1
µ
F/50V
CHD1JZ30F104
C2286
CHIP CERAMIC CAP.(1608) F Z 0.1
µ
F/50V
CHD1JZ30F104
C2300
ELECTROLYTIC CAP. 10
µ
F/16V M
CE1CMASDL100
C2301
CHIP CERAMIC CAP.(1608) F Z 0.1
µ
F/50V
CHD1JZ30F104
C2302
ELECTROLYTIC CAP. 100
µ
F/6.3V M
CE0KMASDL101
C2303
CHIP CERAMIC CAP.(1608) B K 0.01
µ
F/50V
CHD1JK30B103
C2304
ELECTROLYTIC CAP. 22
µ
F/16V M
CE1CMASDL220
C2305
CHIP CERAMIC CAP.(1608) B K 0.01
µ
F/50V
CHD1JK30B103
C2307
CHIP RES.(1608) 1/10W 0
Ω
RRXAZR5Z0000
C2309
CHIP CERAMIC CAP.(1608) F Z 0.1
µ
F/50V
CHD1JZ30F104
C2310
CHIP RES.(1608) 1/10W 0
Ω
RRXAZR5Z0000
C2311
CHIP CERAMIC CAP.(1608) B K 0.47
µ
F/10V
CHD1AK30B474
C2312
CHIP CERAMIC CAP.(1608) F Z 0.1
µ
F/50V
CHD1JZ30F104
C2313
ELECTROLYTIC CAP. 47
µ
F/6.3V M
CE0KMASDL470
C2314
ELECTROLYTIC CAP. 470
µ
F/6.3V M
CE0KMASDL471
C2315
ELECTROLYTIC CAP. 47
µ
F/6.3V M
CE0KMASDL470
C2316
CHIP CERAMIC CAP.(1608) F Z 0.1
µ
F/50V
CHD1JZ30F104
C2317
ELECTROLYTIC CAP. 470
µ
F/6.3V M
CE0KMASDL471
C2318
ELECTROLYTIC CAP. 470
µ
F/6.3V M
CE0KMASDL471
C2319
ELECTROLYTIC CAP. 470
µ
F/6.3V M
CE0KMASDL471
C2600
CHIP CERAMIC CAP. (1608) B K 1
µ
F/16V
CHD1CK30B105
C2601
ELECTROLYTIC CAP. 1000
µ
F/6.3V M
CE0KMASDL102
C2602
ELECTROLYTIC CAP. 1000
µ
F/6.3V M
CE0KMASDL102
C2603
CHIP CERAMIC CAP. (1608) B K 1
µ
F/16V
CHD1CK30B105
C2604
ELECTROLYTIC CAP. 10
µ
F/16V M
CE1CMASDL100
C2605
ELECTROLYTIC CAP. 47
µ
F/25V M
CE1EMASDL470
C2606
ELECTROLYTIC CAP. 100
µ
F/6.3V M
CE0KMASDL101
C2607
ELECTROLYTIC CAP. 1000
µ
F/6.3V M
CE0KMASDL102
C2608
ELECTROLYTIC CAP. 1000
µ
F/6.3V M
CE0KMASDL102
C2609
ELECTROLYTIC CAP. 100
µ
F/6.3V M
CE0KMASDL101
C2610
CHIP CERAMIC CAP.(1608) B K 0.1
µ
F/25V
CHD1EK30B104
C2611
CHIP CERAMIC CAP.(2125) F Z 10
µ
F/10V
CHE1AZ30F106
C2614
CHIP CERAMIC CAP.(1608) B K 0.33
µ
F/10V
CHD1AK30B334
C2705
CARBON RES. 1/4W J 270
Ω
RCX4JATZ0271
C2760
CARBON RES. 1/4W J 270
Ω
RCX4JATZ0271
Ref. No.
Description
Part No.
Summary of Contents for DBS-6,9
Page 3: ...1 1 1 E5H55SP SPECIFICATIONS...
Page 26: ...1 9 4 AV 2 3 Schematic Diagram E5H55SCAV2...
Page 27: ...1 9 5 AV 3 3 Schematic Diagram E5H55SCAV3...
Page 29: ...1 9 7 Front Power SW Schematic Diagram E5H55SCF...
Page 30: ...1 9 8 E5H55SCSD SD Schematic Diagram...
Page 33: ...1 9 11 FE Main 3 5 Schematic Diagram E5H55SCFM3...
Page 44: ...1 9 22 BE Main 9 10 Schematic Diagram E5H55SCBM9...
Page 45: ...1 9 23 BE Main 10 10 Schematic Diagram E5H55SCBM10...
Page 46: ...1 9 24 AV CBA Top View BE5H50F01072A...
Page 47: ...1 9 25 AV CBA Bottom View BE5H50F01072A...
Page 59: ......