Hardware Description
›
The TLE4966 MS2GO Evaluation Kit can be connected
directly to a PC via the micro-USB port (
1
).
›
The TLE4966 MS2GO evaluation kit board consists of:
–
One XMC4200 microcontroller running a SEGGER
Jlink license for debugging (
2
)
–
One XMC1100 microcontroller used as target MCU
(
3
)
–
2x dual NMOS transistors (
4
) used for switching
on/off LEDs. The transistors are used to buffer the
outputs of the sensors and are not controlled by
MCU.
–
Two BSL308PE dual package PMOS transistors (
5
)
used for powering up the TLE4966G (
10
) and
TLE4966V-1G (
12
) sensors
–
One PMOS BSS84P (
6
) used to power up the 3D
sensor magnetic probe TLI493D W2BW (
11
)
–
4 x LEDs for checking visually the sensor output
states (
7
)
–
Mounting hole for lateral placement use-case (
8
)
–
Mounting hole for vertical placement use-case (
9
)
GND
S2_VDD
S2_Q2
S2_Q1
GND
S2_VDD
S2_Q2
S2_Q1
GND
S1_VDD
S1_Q2
S1_Q1
GND
S1_VDD
S1_Q2
S1_Q1
2
1
3
4
4
5
6
7
7
8
9
10
11
12
15
2020-10-08
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