Application Note
27
<Revision 2.4>
<<2019-06-17>>
Assembly Instructions for the Easy-PressFIT Modules
Figure 23
Mounting example of the PCB and module to the cooling system (drawing not true to scale)
The Figure 24 shows a zoom of the final system assembly. Depending on the height of the module, a small air
gap remains between module and PCB.
As the value (H) of Figure 23b must not be higher than the module-to-PCB height of Figure 23a, it is ensured that
no pull forces are applied to the power modules, which would be critical in consideration of the thermal
contact between module and heat sink.
