Preliminary Datasheet
6 of 32
002-29368 Rev. *C
2021-08-02
r e s t r i c t e d
Rapid IoT Connect System on Module
Dual band Wi-Fi and Bluetooth®
System connections
System connections
Power supply connections and recommended external components
shows the general requirements for power pins on CYSBSYS-RP01. See the DC Specifications table for
details on the entire range of supported voltage for each power pins.
Figure 3
Board power pad connections
Bypass capacitors must be used from VBAT_WL, VDDD, and VDDA to ground and wherever indicated in the
diagram. Typical practice for systems in this frequency range is to use a capacitor in the 10-µF range. A parallel
smaller capacitor for each domain is provided on the CYSBSYS-RP01 board. Note that these are rules of thumb:
for critical applications, the PCB layout, lead inductance, and the bypass capacitor parasitic should be simulated
to design and obtain optimal bypassing. All capacitors should be ±20%, X5R ceramic or better.
Power supplies and ports correspond as follows:
• P0: VBACKUP
• P5, P6, P7, P8: VDDIO1
• P9, P10: VDDA
• P11, P12, P13: VDDIO0
• P14: VDDUSB
External reset (XRES)
CYSBSYS-RP01 has an integrated power-on reset circuit, which completely resets all circuits to a known power
on state. This action can also be evoked by an external reset signal, forcing it into a power-on reset state. The
XRES signal is an active LOW signal, which is an input to the CYSBSYS-RP01 (ad 49). The CYSBSYS-RP01 module
does not require an external pull-up resistor on the XRES input.
Power
1.8V
1.8V
1.8V~3.3V
3.6V~4.2V
1.8V
GND
1.8V
1.8V~3.3V
1.8V~3.3V
GND
GND
GND
GND
GND
GND
GND
CYSBSYS-RP01
U1A
VBAT_WL1
22
VBAT_WL2
23
VDDIO_WL
25
GND1
1
GND2
2
GND3
3
GND4
4
GND5
5
GND6
6
GND7
14
GND8
24
GND9
37
GND10
51
GND11
59
GND12
73
VDDD
50
VDDA
65
VBACKUP
56
VDDIO0
55
VDDIO1
67
VDDUSB
54
C7
1uF
16V
C6
1uF
16V
C2
10uF
16V
C1
10uF
16V
C3
10uF
16V
C5
1uF
16V
C4
10uF
16V