CYBLE-022001-00
Document Number: 001-95662 Rev. *N
Page 7 of 41
Pad Connection Interface
As shown in the bottom view of
on page 6, the CYBLE-022001-00 connects to the host board via solder pads on the back
detail the solder pad length, width, and pitch dimensions of the CYBLE-022001-00 module.
Figure 2. Solder Pad Dimensions (Seen from Bottom)
To maximize RF performance, the host layout should follow these recommendations:
1. The ideal placement of the Cypress Bluetooth LE module is in a corner of the host board with the chip antenna located at the far
corner. This placement minimizes the additional recommended keep out area stated in item 2. Refer to
for module
placement best practices.
2. To maximize RF performance, the area immediately around the Cypress Bluetooth LE module chip antenna should contain an
additional keep out area, where no grounding or signal traces are contained. The keep out area applies to all layers of the host
board. The recommended dimensions of the host PCB keep out area are shown in
(dimensions are in mm).
Figure 3. Recommended Host PCB Keep Out Area Around the CYBLE-022001-00 Chip Antenna
Table 2. Solder Pad Connection Description
Name
Connections Connection Type
Pad Length Dimension
Pad Width Dimension
Pad Pitch
SP
21
Solder Pads
0.71 mm
0.41 mm
0.76 mm
Host PCB Keep Out Area Around Chip Antenna
