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5.2 Additional device installation guidance
NOTE
The device can heat up depending on the operating mode, the set parameters
and the heat dissipation to the environment�
The difference between the device's surface temperature and the ambient
temperature must not exceed 25 degrees (according to IEC61010-2-201)� Take
the following measures:
► Reduce surface temperature (→ 5.2.1).
►
Adapt operating mode and parameters�
5.2.1 Reduce surface temperature
Reduce the surface temperature with the following measures:
►
Mount the device on heat-conductive metal parts�
> A large-surface contact of the device with metal parts increases heat
dissipation (e�g� conventional aluminium heat sinks or profiles)�
►
Reduce obstructions around the device� Reduce the density of objects
mounted near the device�
> Obstructions around the device and a high installation density may have a
negative impact on convection (air movement)�
►
Reduce exposure time, frame rate or max� background distance�
> The surface temperature decreases if the parameters are reduced�
5.3 Install device
Observe the following instructions when installing the device:
►
Install the device with 3 x M3 screws�
The hole dimensions are indicated in the scale drawing: www�ifm�com
►
Use strain reliefs for all cables connected to the device�