IEI Technology 167320, User Manual

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WAFER-JL-N5105 SBC
Page 51
4.5 Chassis Installation
4.5.1 Heat Spreader
WARNING:
The heat spreader installed on the WAFER-JL-N5105 can only serve as a heat
conductor, which needs additional heat dissipation mechanism to achieve
suitable thermal condition. DO NOT put the WAFER-JL-N5105 with the heat
spreader directly on a surface that cannot dissipate system heat, and never run
the WAFER-JL-N5105 without the heat spreader secured to the board.
When the WAFER-JL-N5105 is shipped, it is secured to a heat spreader with five retention
screws. The heat spreader must have a direct contact with a heat dissipation surface to
ensure stable operation. In addition, a thin layer of thermal paste has to be applied onto
the heat dissipation surface where it contacts the heat spreader.
Figure 4-4: Heat Sink Retention Screws