![IDT 89HPEB383 User Manual Download Page 257](http://html1.mh-extra.com/html/idt/89hpeb383/89hpeb383_user-manual_618694257.webp)
16. Packaging > Thermal Characteristics
243
PEB383 User Manual
July 25, 2011
Integrated Device Technology, Inc.
Confidential - NDA Required
show the simulated thermal characteristics (Theta JA, Theta JB, and Theta JC)
of the PEB383 package at 66MHz and 33MHz respectively. The thermal resistance
θ
JA
characteristics
of a package depends of multiple variables other than just the package. In a typical application,
designers must take into account various system-level and environmental characteristics, such as:
•
Package mounting (vertical/horizontal)
•
System airflow conditions (laminar/turbulent)
•
Heat sink design and thermal characteristics
•
Heat sink attachment method
•
PWB size, layer count, and conductor thickness
•
Influence of the heat dissipating components assembled on the PWB (neighboring effects)
The results in
and
are based on a JEDEC Thermal Test Board configuration
(JESD51-9), and does not factor in the system-level characteristics described above. As such, these
values are for reference only.
Table 53: Thermal Specifications — 33MHz
Power estimates are based on simulations — 0.511 W @ 33MHz
Package
Parameter
Air Flow
Unit
0 m/s
1 m/s
2 m/s
QFP — EM128
θ
JA
43.9
36.9
33.7
C/W
T
j
Max @ T
AMB
=85°C
107
104
102
C
T
j
Max @ T
AMB
=70°C
92
89
87
C
θ
JC
14
—
—
C/W
QFN — NQ132
θ
JA
23.4
18.5
17
C/W
T
j
Max @ T
AMB
=85°C
97
94
94
C
T
j
Max @ T
AMB
=70°C
82
79
79
C
θ
JC
11.5
C/W
θ
JB
0.42
C/W