![background image](http://html2.mh-extra.com/html/icom/ic-756proiii/ic-756proiii_installing-manual_4137560002.webp)
Connecting the RF cable to the PCB
The 455kHz bidirectional port of the IC-756ProIII is on the bottom side of
the main circuit board. The RF cable center is soldered onto a 1nF
(1000pF) ceramic decoupling capacitor.
The Layout design drawing (left) and the picture of the actual PCB (right and below).
The other lead of the capacitor is bent by 90 degrees and soldered onto
Pin 1 of IC151. For mechanical stability, it is advisable to solder a small
ground wire to the RF cable shield first, and then to the nearby J211. I
also added a drop of hot melt glue to the assembly in order to help reduce
the likelihood of movement by increasing mechanical stability. If required,
cover the exposed shield with heat shrink tubing. During this process,
care must be taken to not overheat the SMD components.
Routing the cable and reassembling of the transceiver
There is enough clearance to route the 6” RF cable over and around
components on the PCB without getting in the way. For mechanical
stability, it is recommended to tack down the RF cable with a dab of hot
melt glue to the top of the Noise Blanker Circuit cover as shown in the
photo below.