IBM System x3530 M4 (E5-2400)
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Low-voltage Intel Xeon processors draw less energy to satisfy the demands of power and thermally
constrained data centers and telecommunication environments.
Low-voltage 1.35 V DDR3 memory RDIMMs consume 19% less energy compared to 1.5 V DDR3
RDIMMs.
Solid-state drives can consume as much as 80% less power than traditional spinning HDDs.
The server uses hexagonal ventilation holes, a part of IBM Calibrated Vectored Cooling™ technology.
Hexagonal holes can be grouped more densely than round holes, providing more efficient airflow
through the system.
IBM Systems Director Active Energy Manager™ provides advanced data center power notification and
management to help achieve lower heat output and reduced cooling needs.
Locations of key components and connectors
The following figure shows the front of the server with four 3.5-inch hot-swap drive bays (models with
3.5-inch simple-swap bays are also available).
Figure 2. Front view of the IBM System x3530 M4 with four 3.5-inch hot-swap drive bays
The following figure shows the front of the server with eight 2.5-inch hot-swap drive bays (models with
2.5-inch simple-swap bays are also available).
Figure 3. Front view of the IBM System x3530 M4 with eight 2.5-inch hot-swap drive bays
