HUAWEI MU709 Series HSPA+ LGA Module
Hardware Guide
Mechanical Specifications
Issue 09 (2017-12-15)
Huawei Proprietary and Confidential
Copyright © Huawei Technologies Co., Ltd.
72
6.8 Assembly Processes
6.8.1 Overview
Tray modules are required at SMT lines, because LGA modules are placed on
ESD pallets.
Reflow ovens with at least seven temperature zones are recommended.
Use reflow ovens or rework stations for soldering, because LGA modules have
large solder pads and cannot be soldered manually.
6.8.2 Stencil Design
It is recommended that the stencil for the LGA module be 0.15 mm in thickness. For
the stencil design, see the following figure:
Figure 6-7
Recommended stencil design of LGA module (unit: mm)
The stencil design has been qualified for HUAWEI motherboard assembly, customers can
adjust the parameters by their motherboard design and process situation to assure LGA
soldering quality and no defect.
6.8.3 Reflow Profile
The LGA module must be reflowed on the top side of customer's development board.
For the soldering temperature of the LGA module, see the following figure.
