Huawei MU709Gs-8 Quick Start Manual Download Page 9 | Manualshive

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Soak zone
(150°C–200°C)

(t1–t2): 60s–120s

Heating rate: < 1.0°C/s

Reflow zone (> 217°C)

(t3–t4): 30s–90s

Peak reflow

temperature:
230°C–250°C

Cooling zone

Cooling rate: 1°C/s ≤ Slope ≤ 4°C/s

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Summary of Contents for MU709Gs-8

Page 1: ... approved by respective copyright holders under licenses Trademarks and Permissions and are trademarks or registered trademarks of Huawei Technologies Co Ltd Other trademarks product service and company names mentioned are the property of their respective owners Notice Some features of the product and its accessories described herein rely on the software installed capacities and settings of local ...

Page 2: ... MAXIMUM EXTENT PERMITTED BY APPLICABLE LAW IN NO CASE SHALL HUAWEI TECHNOLOGIES CO LTD BE LIABLE FOR ANY SPECIAL INCIDENTAL INDIRECT OR CONSEQUENTIAL DAMAGES OR LOST PROFITS BUSINESS REVENUE DATA GOODWILL OR ANTICIPATED SAVINGS Import and Export Regulations Customers shall comply with all applicable export or import laws and regulations and will obtain all necessary governmental permits and licen...

Page 3: ...i Contents Getting to Know the MU709 1 PCB Design 2 Assembly 3 ...

Page 4: ...ation the process for PCB Design Assembly and safety precautions You are recommended to read the manual before using the MU709 Getting to Know the MU709 The package of the LGA module is 145 pin LGA with a dimension of 30 mm 30 mm 2 27 mm It is applied to the user interface board and can be used as a wireless terminal in a network environment ...

Page 5: ... reliability it is recommended that the PCB pad size be designed as follows the sizes of the solder pads on customers PCBs are the same as those of the module s solder pads for the high production efficiency and high reliability of solder joints For details see the following figure ...

Page 6: ...ects caused by uneven weight Design of Solder Mask The PCB pad design can be solder mask defined SMD or non solder mask defined NSMD NSMD is recommended In addition the solder mask of the NSMD pad design is larger than the pad so the reliability of the solder joint can be improved The solder mask must be 100 µm to150 µm larger than the pad that is the single side of the solder mask must be 50 µm t...

Page 7: ...4 0 6 ...

Page 8: ... Profile For the soldering temperature of the LGA module see the following figure Reflow profile Reflow parameters Temperature Zone Time Key Parameter Preheat zone 40 C 150 C 60s 120s Heating rate 0 5 C s 2 C s ...

Page 9: ...6 Soak zone 150 C 200 C t1 t2 60s 120s Heating rate 1 0 C s Reflow zone 217 C t3 t4 30s 90s Peak reflow temperature 230 C 250 C Cooling zone Cooling rate 1 C s Slope 4 C s ...

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