HUAWEI ME909 Series LTE LGA Module
Hardware Guide
Mechanical Specifications
Issue V0.3 (2013-05-21)
Huawei Proprietary and Confidential
Copyright © Huawei Technologies Co., Ltd.
66
Figure 6-2
ME909 label (ME909u-521 for example)
The picture mentioned above is only for reference.
The silk-screen should be clear, without burrs, and dimension should be accurate.
The material and surface finishing and coatings which used have to make satisfied with the
EU WEEE and RoHS directives.
The label must be heated up for 20s
–40s and able to endure the high temperature of 260°C.
And the color of the material of the nameplate cannot change.
6.7 Customer PCB Design
6.7.1
PCB Surface Finish
The PCB surface finish recommended is Electroless Nickel, immersion Gold (ENIG).
Organic Solderability Preservative (OSP) may also be used, ENIG preferred.
6.7.2
PCB Pad Design
To achieve assembly yields and solder joints of high reliability, it is recommended that
the PCB pad size be designed as follows:
28mm
28mm
R=1mm
1.1*1.1mm
8X8mm
8X8mm
