ME60
Hardware Description
1 Hardware Description
Issue 01 (2018-05-07)
356
Attribute
Description
Optical type
supported
1.11.11 10Gbps SFP+ Optical Module
1.11.12 10Gbps SFP+ CWDM Optical Module
1.11.13 10Gbps SFP+ BIDI Optical Module
1.11.14 10Gbps SFP+ DWDM Optical Module
Working mode
Full-duplex
Compliant
standard
IEEE 802.3
Frame format
Ethernet_II, Ethernet_SAP and Ethernet_SN/AP
Table 1-576
Board specifications
Item
Specification
Dimensions (H x W x D)
40.1 mm x 399.2 mm x 535.6 mm (1.58 in. x 15.72 in. x
21.09 in.)
Typical power
consumption
429.0 W
Typical heat dissipation
1391.9 BTU/hour
Weight
9.4 kg (20.73 lb)
Ambient temperature
Long terms: 0 °C to 45 °C (32°F to 113°F) Short terms:
-5 °C to 55 °C (23°F to 131°F)
1.10.15 1T board
1.10.15.1 8-Port 100GBase-CFP2 Multi Service Unit Integrated(MSUI-1T)
Overview
Table 1-577
Board attributes
Attribute
Description
Board name silkscreen
MSUI-1T 8x100GBase-CFP2
Description
8-Port 100GBase-CFP2 Multi Service Unit
Integrated(MSUI-1T)
BOM
03057644
Model
ME0D0L8NCA70