
ME60
Hardware Description
1 Hardware Description
Issue 01 (2018-05-07)
463
Item
Specification
Minimum extinction ratio (dB)
8.2
1.11.13 10Gbps SFP+ BIDI Optical Module
Figure 1-114
10Gbps SFP+ BIDI Optical Module
1.11.13.1 10Gbps-SFP+-SMF-1270nm-10km-industry
Table 1-672
Technical specifications
Item
Specification
BOM
34060544-002
Model
OSX010B10
Encapsulation mode
SFP+
Interface standard
IEEE 802.3ae, 10GBASE-BX10-U
Bit Error Ratio (BER)
<1x10E–12
Working case temperature (°C)
-40 °C to 85 °C (-40°F to 185°F)
Digital diagnosis
SFF-8472
Environment standard
RoHS
Security standard
FCC class B, IEC 60825-1 Class 1
ESD(HBM1) (V)
500
Transmission rate (bit/s)
9.953G/10.3125G
Connector type
LC
Transmission distance (km)
10
Optical fiber type
SMF