HUAWEI ME309-562 eMTC LGA Module
Hardware Guide
Contents
1 Introduction.................................................................................................................................... 5
2 Overall Description ...................................................................................................................... 6
2.1 About This Chapter ........................................................................................................................... 6
2.2 Function Overview............................................................................................................................ 6
2.3 Circuit Block Diagram ....................................................................................................................... 7
2.4 Application Block Diagram ............................................................................................................... 8
3 Description of the Application Interfaces .............................................................................. 10
3.1 About This Chapter ......................................................................................................................... 10
3.2 LGA Interface ................................................................................................................................. 10
4 Mechanical Specifications ......................................................................................................... 20
4.1 About This Chapter ......................................................................................................................... 20
4.2 Storage Requirement ..................................................................................................................... 20
4.3 Moisture Sensitivity ........................................................................................................................ 20
4.4 Dimensions ..................................................................................................................................... 20
4.5 Customer PCB Design ................................................................................................................... 22
4.5.1 PCB Surface Finish ............................................................................................................... 22
4.5.2 PCB Pad Design .................................................................................................................... 22
4.5.3 Solder Mask ........................................................................................................................... 24
4.5.4 Requirements on PCB Layout ............................................................................................... 24
4.5.5 Stencil Design ........................................................................................................................ 24
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