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HUAWEI MC509 Series CDMA LGA Module
Hardware Guide

Description of the Application Interfaces

Issue 02 (2013-05-06)

Huawei Proprietary and Confidential

Figure 3-4

Power on timing sequence

Table 3-4

Power on timing

Parameter

Comments

Time(Nominal values) Units

PON

POWER_ON_OFF turn on time.

0.5< T

PON

PD+

POWER_ON_OFF Valid to USB
D+ high

If the DTE needs to detect the PID/VID of module during the BIOS phase, the
detection time should exceed the T

PD+

time.

Figure 3-5

Power off timing

Summary of Contents for MC509

Page 1: ...HUAWEI MC509 Series CDMA LGA Module Hardware Guide Issue 02 Date 2013 05 06 ...

Page 2: ...emarks product service and company names mentioned are the property of their respective owners Notice Some features of the product and its accessories described herein rely on the software installed capacities and settings of local network and may not be activated or may be limited by local network operators or network service providers thus the descriptions herein may not exactly match the produc...

Page 3: ...Table 3 1 Definitions of pins on the LGA interface 3 2 Updated Figure 3 1 Bottom view of sequence of LGA interface pins 3 3 Deleted the description related to VCOIN interface 3 4 3 Updated Table 3 6 List of the LED_STATUS pin and LED_MODE pin 3 5 Updated the description of UART Interface 3 7 1 Updated Table 3 9 RUIM card interface signals 3 7 2 Updated Figure 3 16 Circuit of the RUIM card interfac...

Page 4: ...tion Block Diagram of the product 3 Description of the Application Interfaces Describes the external application interfaces of the product 4 RF Specifications Describes the RF specifications of the product 5 Electrical and Reliability Features Describes the electrical and reliability features of the interfaces in the product 6 Mechanical Specifications Describes the Dimensions Label and Packing Sy...

Page 5: ...22 3 3 1 Overview 22 3 3 2 VBAT Interface 23 3 3 3 Output Power Supply Interface 24 3 4 Signal Control Interface 24 3 4 1 Overview 24 3 4 2 Input Signal Control Pins 25 3 4 3 Output Signal Control Pin 29 3 4 4 WAKEUP_IN Signal 33 3 4 5 WAKEUP_OUT Signal 33 3 5 UART Interface 34 3 5 1 Overview 34 3 5 2 Circuit Recommended for the UART Interface 35 3 6 USB Interface 36 3 7 RUIM Card Interface 37 3 7...

Page 6: ... 2 Interference 50 4 6 3 CDMA Antenna Requirements 50 4 6 4 Radio Test Environment 51 5 Electrical and Reliability Features 52 5 1 About This Chapter 52 5 2 Extreme Working Conditions 52 5 3 Operating and Storage Temperatures and Humidity 53 5 4 Electrical Features of Application Interfaces 53 5 5 Power Supply Features 54 5 5 1 Input Power Supply 54 5 5 2 Power Consumption 54 5 6 Reliability Featu...

Page 7: ...ea Treatment 70 6 10 5 Module Installation 70 6 10 6 Specifications of Rework 71 7 Certifications 72 7 1 About This Chapter 72 8 Safety Information 73 8 1 Interference 73 8 2 Medical Device 73 8 3 Area with Inflammables and Explosives 73 8 4 Traffic Security 74 8 5 Airline Security 74 8 6 Safety of Children 74 8 7 Environment Protection 74 8 8 RoHS Approval 74 8 9 Laws and Regulations Observance 7...

Page 8: ...to as the MC509 module is used This document helps you to understand the interface specifications electrical features and related product information of the MC509 module Product name Model name Description MC509 MC509 CDMA EVDO 1900 MHz 800 MHz GPS MC509 MC509 a CDMA EVDO 800 MHz GPS CDMA EVDO 1900 MHz 800 MHz Data only or Telematics MC509 model has two editions Data only or Telematics Data only d...

Page 9: ...ram 2 2 Function Overview Table 2 1 Feature Feature Description Physical Features Dimensions L W H 30 mm 30 mm 2 65 mm Weight about 5 5 g Working Bands MC509 CDMA2000 1x CDMA2000 EV DO Rev 0 CDMA2000 EV DO Rev A Supports BC0 800MHz band BC1 1900MHz band GPS MC509 a CDMA2000 1x CDMA2000 EV DO Rev 0 CDMA2000 EV DO Rev A Supports BC0 800MHz band GPS Operating Temperature Normal working temperature 20...

Page 10: ...rphone out 1 PCM USB 2 0 full speed Power on off Hardware Reset Wakeup_In Wakeup_out Light emitting Diode Configurable General purpose I O GPIO WWAN MAIN antenna pad x1 WWAN AUX antenna pad x1 GPS antenna pad x1 Power SMS New message alert text message receiving and text message sending Management of text messages read messages delete messages storage status and list message Support for the Protoc...

Page 11: ...tly deviate from 3GPP2 C S057D specifications 2 3 Circuit Block Diagram Figure 2 1 shows the circuit block diagram of the MC509 module The application block diagram and major functional units of the MC509 module contain the following parts Single chip Multi chip package MCP memory RF Circuit Figure 2 1 Circuit block diagram of the MC509 module Only telematics version supports the audio function MC...

Page 12: ...e UART Interface The module supports 8 wire UART USB Interface The USB interface supports USB 2 0 full speed standard RUIM Interface The RUIM interface provides the interface for a RUIM card The RUIM card can be inserted into the host side Power Supply DC 3 8 V is recommended Audio Interface The module supports two microphone one earphone one speaker and one PCM interface only telematics version s...

Page 13: ...gnal Control Interface UART Interface USB Interface RUIM Card Interface Audio Interface General Purpose I O Interface JTAG Interface RF Antenna Interface Reserved Interface NC Interface 3 2 LGA Interface The MC509 module uses a 145 pin LGA as its external interface For details about the module and dimensions of the LGA see 6 4 Dimensions and interfaces If DTE supports Huawei LGA module such as mod...

Page 14: ... sync 0 3 2 6 2 9 6 PCM_DIN I PCM I F data in 0 3 2 6 2 9 7 PCM_DOUT O PCM I F data out 0 3 2 6 2 9 8 PCM_CLK O PCM interface clock 0 3 2 6 2 9 9 NC Not connected please keep this pin open 10 NC Not connected please keep this pin open 11 WAKEUP_IN I Host to wake up Module 0 3 2 6 2 9 12 VBAT P Power supply input 3 3 3 8 4 2 13 VBAT P Power supply input 3 3 3 8 4 2 14 PS_HOLD Used for JTAG interfac...

Page 15: ... connected please keep this pin open 28 Reserved Reserved 29 Reserved Reserved 30 JTAG_TMS I JTAG Test mode select 0 3 2 6 2 9 31 VCC_EXT2 P 2 6V POWER output 2 6 32 VCC_EXT1 P 1 8V POWER output 1 8 33 NC Not connected please keep this pin open 34 RUIM_VCC P Power supply for RUIM card 1 8 2 85 35 NC NC 36 JTAG_TRST_N I JTAG reset 0 3 2 6 2 9 37 NC Not connected please keep this pin open 38 MIC2_P ...

Page 16: ...ole of the input of audio interface 1 42 JTAG_TCK I JTAG clock input 0 3 2 6 2 9 43 Reserved Reserved 44 GPIO I O General I O pin The function of these pins has not been defined 0 3 2 6 2 9 45 W_DISABLE I Close wireless communications 0 3 2 6 2 9 46 GPIO I O General I O pins The function of these pins has not been defined 0 3 2 6 2 9 47 NC Not connected please keep this pin open 48 GND Ground 49 G...

Page 17: ...ed please keep this pin open 68 NC Not connected please keep this pin open 69 NC Not connected please keep this pin open 70 NC Not connected please keep this pin open 71 WAKEUP_OUT O Module to wake up the host 0 3 2 6 2 9 72 JTAG_TDO O JTAG test data output 0 3 2 6 2 9 73 UART_DSR O UART Data Set Ready 0 3 2 6 2 9 74 UART_RTS O UART Ready for receive 0 3 2 6 2 9 75 UART_DCD O UART Data Carrier Det...

Page 18: ...lock 1 8 2 85 91 LED_STATUS I Status indicator SINK current source Driver strength 10mA 92 NC Not connected please keep this pin open 93 JTAG_RTCK I JTAG return clock 0 3 2 6 2 9 94 NC Not connected please keep this pin open 95 NC Not connected please keep this pin open 96 EAR_OUT_N AO Only telematics version supports audio function Data only version does not support this function Negative pole of...

Page 19: ... 102 NC Not connected please keep this pin open 103 NC Not connected please keep this pin open 104 NC Not connected please keep this pin open 105 GPIO I O General I O pins The function of these pins has not been defined 0 3 2 6 2 9 106 GND Ground 107 MAIN_ANT RF main antenna pad 108 GND Ground 109 GPIO I O General I O pins The function of these pins has not been defined 0 3 2 6 2 9 110 GND Ground ...

Page 20: ... 124 GND Thermal Ground Pad 125 GND Thermal Ground Pad 126 GND Thermal Ground Pad 127 GND Thermal Ground Pad 128 GND Thermal Ground Pad 129 GND Thermal Ground Pad 130 GND Thermal Ground Pad 131 GND Thermal Ground Pad 132 GND Thermal Ground Pad 133 GND Thermal Ground Pad 134 GND Thermal Ground Pad 135 GND Thermal Ground Pad 136 GND Thermal Ground Pad 137 GND Thermal Ground Pad 138 GND Thermal Groun...

Page 21: ...al input AO indicates pins for analog signal output The NC Not Connected pins are internally connected to the module Therefore these pins should not be used otherwise they may cause problems Please contact us for more details about this information The Reserved pins are internally connected to the module Therefore these pins should not be used otherwise they may cause problems Please contact with ...

Page 22: ...fidential Copyright Huawei Technologies Co Ltd 22 Figure 3 1 Bottom view of sequence of LGA interface pins 3 3 Power Interface 3 3 1 Overview The power supply part of the MC509 module contains VBAT pins for the power supply VCC_EXT1 pin for external power output VCC_EXT2 pinfor external power output RUIM_VCC PIN for RUIM card power output ...

Page 23: ...s for external power input To ensure that the MC509 module works normally all the pins must be used efficiently When the MC509 module is used for different external applications pay special attention to the design for the power supply When the MC509 module transmits signals at the maximum power the transient current may reach the transient peak value of about 1 5 A due to the differences in actual...

Page 24: ...A typical value for external level conversion or other applications If the MC509 module is in Sleep mode the Output Power Supply interface is in the low power consumption state If the MC509 module is in Power Down mode the Output Power Supply is in the disabled state 3 4 Signal Control Interface 3 4 1 Overview The signal control part of the interface in the MC509 module consists of the following P...

Page 25: ... 2 6 2 9 45 W_DISABLE I Close wireless communications 0 3 2 6 2 9 It is recommended that use resistance of 0 Ω in the DTE to isolate signals transmitted from above pins in Table 3 3 3 4 2 Input Signal Control Pins The MC509 module implements power on and power off and resets the hardware through the input signal control pins The power on power off and reset control parts of the interface of the MC...

Page 26: ...a distance of 2 54 mm 100 mil at least from the PCB edge Furthermore you need to wrap the area adjacent to the signal wire with a ground wire Otherwise the module may be reset due to interference Figure 3 3 shows the connections of the POWER_ON_OFF and RESIN_N pins Figure 3 3 Connections of the POWER_ON_OFF and RESIN_N pins Power On Time Sequence After VBAT has been applied and is stable the modul...

Page 27: ...wei Technologies Co Ltd 27 Figure 3 4 Power on timing sequence Table 3 4 Power on timing Parameter Comments Time Nominal values Units TPON POWER_ON_OFF turn on time 0 5 TPON 1 s TPD POWER_ON_OFF Valid to USB D high 4 s If the DTE needs to detect the PID VID of module during the BIOS phase the detection time should exceed the TPD time Figure 3 5 Power off timing ...

Page 28: ...dule supports hardware reset function If the software of the MC509 module stops responding the MC509 module can be reset through the RESIN_N signal After the hardware is reset the software starts powering on the module and reports relevant information according to the actual settings Figure 3 6 Reset pulse timing The low level pulse through the RESIN_N pin cannot last for more than 2s Otherwise th...

Page 29: ...l Pin The MC509 module provides a network status LED pin LED_STATUS and LED_MODE The pulse signal output through this pin controls the status LED on the user interface board to display the network status The LEDs are controlled by a current sink The high voltage is the voltage of VBAT with the typical value of 3 8 V Different blinking modes of the status LED indicate different network status Table...

Page 30: ...ND OFF 2 3G PS Service Connected in a packet data connection Dormant OPEN Always ON GND OFF 3 3G PS Service Connected in a packet data connection but actively transferring data The indicator blinks fast GND OFF 4 The software is being downloaded or upgraded GND OFF The indicator blinks fast 5 Module is not registered but searching for a operator CREG 0 2 or CREG 0 0 the indictor blinks twice each ...

Page 31: ...9 Status when the indictor blinks fast Blinking Twice Each Time Figure 3 10 Status when the indictor blinks twice each time External Circuits Figure 3 11 shows the recommended circuits of the LED_MODE and LED_STATUS pins According to LED feature you can adjust the LED brightness by adjusting the impedance of resistor R 100 ms Light off Light on 1 cycle 200 ms 100 ms 100 ms 100 ms Light on Light of...

Page 32: ...LED 19 213 GVC AMNB 3T as an example its manufacturer is Everlight Electronics Ltd And the website is http www everlight com Figure 3 12 shows its IF VF curves If VBAT is 3 8 V and the desired current through the LED IF is 3 mA then the voltage of the LED VF is 1 5 V according to IF VF curves and the corresponding value for resistance of R is 3 8 1 5 0 003 767 Ω The brightness of the LED depends o...

Page 33: ...09 module through the WAKEUP_IN signal If there is no external WAKEUP_IN signal the wireless module keeps in the wakeup status by default After receiving the WAKEUP_IN signal the wireless module determines whether to enter the sleep mode according to the level status of the WAKEUP_IN signal Table 3 3 shows the definition of the WAKEUP_IN signal 3 4 5 WAKEUP_OUT Signal The WAKEUP_OUT signal is used...

Page 34: ...l As the UART interface supports signal control through standard modem handshake AT commands are entered and serial communication is performed through the UART interface The UART has the following features Full duplex 7 bit or 8 bit data 1 bit or 2 bit stop bit Odd parity check even parity check or non check Baud rate clock generated by the system clock Direct memory access DMA transmission Baud r...

Page 35: ...tion on the wireless module The DTE is notified of a remote call 0 3 2 6 2 9 74 UART_RTS O Data sending request on the wireless module The DTE notifies the DCE of sending requests 0 3 2 6 2 9 79 UART_DTR I Data terminal ready on the wireless module The DTE is ready 0 3 2 6 2 9 80 UART_CTS I Clearing to send on the wireless module The DCE switches to the receiving mode 0 3 2 6 2 9 75 UART_DCD O Dat...

Page 36: ...als are connected to a host with 3 3 V level a level conversion circuit is required Make sure that the level of the UART signals are 0 V before MC509 module is powered on to avoid the wind blow in which may cause the module cannot work properly The level of RS 232 Transceivers must match that of the MC509 module 3 6 USB Interface The MC509 is compliant with USB 2 0 full speed protocol The USB inte...

Page 37: ... and RV103 must be Voltage Sensitive Resistor with small capacitance ALVC18S02003 manufactured by AMOTECH or B72590T7900V60 manufactured by EPCOS is recommended In addition The layout design of this circuit on the DTE board should comply with the USB 2 0 full speed protocol with differential lining and impedance control to 90 ohm It is recommended that set USB D and USB D pins as test points and t...

Page 38: ...al RUIM 1 8 2 85 89 RUIM_DATA I O External RUIM data signal 1 8 2 85 90 RUIM_CLK O External RUIM clock signal 1 8 2 85 88 RUIM_RESET O External RUIM reset signal 1 8 2 85 3 7 2 Circuit Recommended for the RUIM Card Interface As the MC509 module is not equipped with a RUIM card socket a RUIM card socket need to be placed on the user interface board The RUIM card signals are transmitted outwards thr...

Page 39: ...scription of the Application Interfaces Issue 02 2013 05 06 Huawei Proprietary and Confidential Copyright Huawei Technologies Co Ltd 39 Figure 3 17 Pin definition of RUIM Socket pin1 RUIM_VCC pin2 RUIM_RESET pin3 RUIM_CLK pin4 GND pin5 NULL pin6 RUIM_DATA ...

Page 40: ...o take electrostatic discharge ESD protection measures near the RUIM card socket The TVS diode with Vrwm of 5 V and junction capacitance less than 10 pF must be placed as close as possible to the USIM socket and the Ground pin of the ESD protection component is well connected to the power Ground pin that supplies power to the MC509 module 3 8 Audio Interface 3 8 1 Analogue Audio The MC509 provides...

Page 41: ...t audio channel Figure 3 19 Circuit diagram of the interface of the second audio channel It is recommended that a TVS be used on the related interface to prevent electrostatic discharge and protect integrated circuit IC components Data only does not support the voice function 3 8 2 Digital Audio The MC509 provides one digital audio channels Data only doesn t support the voice function Table 3 10 l...

Page 42: ... codec to support linear and μ law format The PCM_SYNC runs at 8 kHz with a 50 duty cycle Figure 3 20 Circuit diagram of the interface of the PCM MC509 is used as PCM master PCM_SYNC Output when PCM master PCM_CLK Output when PCM master It is recommended that a TVS be used on the related interface to prevent electrostatic discharge and protect integrated circuit IC components Data only edition doe...

Page 43: ... pins 0 3 2 6 2 9 3 10 JTAG Interface LGA MC509 module provides one JTAG interface Joint Test Action Group Set the pins in the following table as the test pins And place the test points in the DTE for debugging Pin No Pin Name I O Description DC Characteristics V Min Typ Max 30 JTAG_TMS I JTAG Test mode select 0 3 2 6 2 9 36 JTAG_TRST_N I JTAG reset 0 3 2 6 2 9 42 JTAG_TCK I JTAG clock input 0 3 2...

Page 44: ...reserved at the antenna port Table 3 11 Signals on RF Antenna interface Pin No Pin Name I O Description 107 MAIN_ANT RF main antenna pad 111 GPS_ANT RF GPS antenna pad 115 AUX_ANT RF divert antenna pad 3 12 Reserved Interface The module provides 4 reserved pins All of reserved pins cannot be used by the customer Table 3 12 List of reserved pins Pin No Pin Name I O Description 15 28 29 43 Reserved ...

Page 45: ...tenna Installation Guidelines Install the antenna in a place covered by the signal The Antenna must be installed to provide a separation distance of at least 20 cm from all persons and must not be co located or operating in conjunction with any other antenna or transmitter Antenna must not be installed inside metal cases Antenna must be installed also according Antenna manufacturer instructions 4 ...

Page 46: ...l 3GPP2 test standards relating to 3G Each module passes strict tests at the factory and thus the quality of the modules is guaranteed 4 5 Conducted Rx Sensitivity and Tx Power 4 5 1 Conducted Receive Sensitivity The conducted receive sensitivity is a key parameter that indicates the receiver performance of MC509 The 3GPP Protocol Claim column in Table 4 2 lists the required minimum values and the...

Page 47: ...um power Table 4 3 MC509 conducted Tx power Unit dBm Item MC509 Test Value dBm Min Typ Max BC0 CDMA 800 MHz 23 24 25 BC1 CDMA 1900 MHz 23 24 25 4 6 Antenna Design Requirements 4 6 1 Antenna Design Indicators Antenna Efficiency Antenna efficiency is the ratio of the input power to the radiated or received power of an antenna The radiated power of an antenna is always lower than the input power due ...

Page 48: ...eak correlation to wireless performance Isolation For a wireless device with multiple antennas the power of different antennas is coupled with each other Antenna isolation is used to measure the power coupling The power radiated by an antenna might be received by an adjacent antenna which decreases the antenna radiation efficiency and affects the running of other devices To avoid this problem eval...

Page 49: ...mended envelope correlation coefficient between the primary antenna and the diversity antenna is smaller than 0 5 Radiation Pattern The radiation pattern of an antenna reflects the radiation features of the antenna in the remote field region The radiation pattern of an antenna commonly describes the power or field strength of the radiated electromagnetic waves in various directions from the antenn...

Page 50: ...rd there are various interference sources such as the LCD CPU audio circuits and power supply All the interference sources emit interference signals that affect the normal operation of the module For example the module sensitivity can be decreased due to interference signals Therefore during the design you need to consider how to reduce the effects of interference sources on the module You can tak...

Page 51: ... OTA test environments SATIMO microwave testing chambers and ETS microwave testing chambers The testing chambers are certified by professional organizations and are applicable to testing at frequencies ranging from 380 MHz to 6 GHz The test items are described as follows Passive Tests Antenna efficiency Gain Pattern shape Envelope correlation coefficient Active Tests TRP GSM WCDMA CDMA TD SCDMA an...

Page 52: ... Extreme Working Conditions Operating and Storage Temperatures and Humidity Electrical Features of Application Interfaces Power Supply Features Reliability Features EMC and ESD Features 5 2 Extreme Working Conditions Table 5 1 lists the extreme working conditions for the MC509 module Using the MC509 module beyond these conditions may result in permanent damage to the module Table 5 1 Extreme worki...

Page 53: ...res 1 30 to 20 70 to 75 C Ambient temperature for storage 40 85 C Moisture 5 95 1 The temperatures outside of the range 20 C to 70 C the module might slightly deviate from 3GPP2 C S057D specifications 5 4 Electrical Features of Application Interfaces Table 5 3 lists electrical features typical values Table 5 3 Electrical features of application interfaces Parameter Description Minimum Value Maximu...

Page 54: ... Unit VBAT 3 3 3 8 4 2 50 mVpp 0 Hz to 2 5 GHz V Table 5 5 Requirements for input current of the MC509 module Power Peak Maximum Normal Maximum 3 8 V 1500 mA 1000 mA 5 5 2 Power Consumption The power consumptions of MC509 in different scenarios are respectively listed in Table 5 6 The power consumption listed in this section is tested when the power supply of MC509 module is 3 8 V Typical values a...

Page 55: ...tandard Low temperature storage Temperature 40º C 2º C Test duration 24 h IEC60068 High temperature storage Temperature 85º C 2º C Test duration 24 h IEC60068 Low temperature working Temperature 30º C 2º C Test duration 24 h IEC60068 High temperature working Temperature 75º C 2º C Test duration 24 h IEC60068 Damp heat cycling High temperature 55º C 2º C Low temperature 25º C 2º C Humidity 95 Repet...

Page 56: ... direction IEC60068 Drop test First case 0 3 m in height Drop the MC509 module on the marble terrace with one surface facing downwards twice Six surfaces should be tested Second case 0 8 m in height Drop the MC509 module on the marble terrace with one surface facing downwards twice Six surfaces should be tested IEC60068 5 7 EMC and ESD Features EMC tests have to be performed on the application as ...

Page 57: ...face lines preferably 10 cm EMC protection on audio input output filters against 900MHz emissions Biasing of the microphone inputs Ground plane HUAWEI Wireless recommends a common ground plane for analog digital RF grounds A metallic case or plastic casing with conductive paint is recommended except for the area around the antenna The HUAWEI MC509 Module does not include any protection against ove...

Page 58: ...mbly Processes Specification of Rework 6 2 Storage Requirement The module must be stored and sealed properly in vacuum package under a temperature below 40º C and the relative humidity less than 90 in order to ensure the weldability within 12 months 6 3 Moisture Sensitivity The moisture sensitivity is level 3 After unpacking the module must be assembled within 168 hours under the environmental con...

Page 59: ...Co Ltd 59 Table 6 1 Baking parameters Baking Temperature Baking Condition Baking Duration Remarks 125º C 5º C Relative humidity 60 8 hours Moving storing and processing the product must comply with IPC JEDEC J STD 033 6 4 Dimensions and interfaces The dimension of MC509 is 30 mm length 30 mm width 2 65 mm height Figure 6 1 shows the dimensions of MC509 in details ...

Page 60: ...UAWEI MC509 Series CDMA LGA Module Hardware Guide Mechanical Specifications Issue 02 2013 05 06 Huawei Proprietary and Confidential Copyright Huawei Technologies Co Ltd 60 Figure 6 1 Dimensions of MC509 ...

Page 61: ...der joints of high reliability it is recommended that the PCB pad size be designed as follows the size of the pad in the middle region is the same as the pad size of the product package other pads are 0 05 mm larger than the unilateral pad of the product package For details see Figure 6 2 Figure 6 2 PCB pad design 6 6 Packaging HUAWEI LGA module uses five layers ESD pallet anti vibration foam and ...

Page 62: ... Ltd 62 All materials used must meet eco friendly requirements According to the requirements and test methods specified in EIA 541 the surface resistance must range from 10 000 Ω to 1000 000 Ω Packaging materials must be resistant to temperature higher than or equal to 150º C Triboelectricity must be lower than 100 V The following figure shows the packaging ESD PPE ...

Page 63: ...ch the packages with labels indicating that the LGA modules contained in the packages are MSL 3 components Packages must be made of ESD materials Packages or containers must be attached with ESD labels 6 7 Label The label is made from deformation resistant fade resistant and high temperature resistant material and is able to endure the high temperature of 260º C 6 trays in each vacuum package Do n...

Page 64: ...uld not be covered by the film The material and surface finishing and coatings which used have to make satisfied with the RoHS directives The label must be heated up for 20s 40s and able to endure the high temperature of 260º C And the color of the material of the nameplate can t change 6 8 Customer PCB Design 6 8 1 PCB Surface Finish The PCB surface finish recommended is Electroless Nickel immers...

Page 65: ...ommended In addition the solder mask of the NSMD pad design is larger than the pad so the reliability of the solder joint can be improved The solder mask must be 100 µm 150 µm larger than the pad that is the single side of the solder mask must be 50 µm 75 µm larger than the pad The specific size depends on the processing capability of the PCB manufacturer 6 8 4 Requirements on PCB Layout To reduce...

Page 66: ...d in module re melding defects caused by uneven weight 6 9 Assembly Processes 6 9 1 General Description of Assembly Processes Tray modules are required at SMT lines because LGA modules are placed on ESD pallets Reflow ovens with at least seven temperature zones are recommended Use reflow ovens or rework stations for soldering because LGA modules have large solder pads and cannot be soldered manual...

Page 67: ...igure 6 6 Recommended stencil design of LGA module The stencil design has been qualified for HUAWEI mainboard assembly customers can adjust the parameters by their motherboard design and process situation to assure LGA soldering quality and no defect 6 9 3 Reflow Profile For the soldering temperature of the LGA module see the following figure PCB PADS Stencil design Unit mm ...

Page 68: ...echnologies Co Ltd 68 Figure 6 7 Reflow profile Table 6 2 Reflow parameters Temperature Zone Time Key Parameter Preheat zone 40º C 150º C 60s 120s Heating rate 0 5º C s 2º C s Soak zone 150º C 200º C t1 t2 60s 120s Heating rate 1 0º C s Reflow zone 217º C t3 t4 30s 90s Peak reflow temperature 230º C 250º C Cooling zone Cooling rate 1º C s Slope 4º C s ...

Page 69: ...k but controllable in order to melt all the solder joints simultaneously Pay attention to protect the module PCB neighboring devices and their solder joints against heating or mechanical damages The LGA module has many solder pads and the pads are large Therefore common soldering irons and heat guns cannot be used in the rework Rework must be done using either infrared heating rework stations or h...

Page 70: ... is recommended that a fixture and a mini stencil be made to apply the solder paste in the rework 6 10 5 Module Installation Install the module precisely on the module and ensure the right installation direction of the module and the reliability of the electrical connection with the PCB It is recommended that the module be preheated in order to ensure that the temperature of all parts to be solder...

Page 71: ...echnologies Co Ltd 71 6 10 6 Specifications of Rework Temperature parameter of rework for either the removing or welding of the module the heating rate during the rework must be equal to or smaller than 3 C s and the peak temperature between 240º C 250º C The following parameters are recommended during the rework Figure 6 9 Temperature graph of rework ...

Page 72: ...onfidential Copyright Huawei Technologies Co Ltd 72 7 Certifications 7 1 About This Chapter This chapter gives a general description of certifications for MC509 Table 7 1 Product Certifications Certification Model name MC509 MC509 a FCC RoHS CCC The model of MC509 a module for CCC certification is HUAWEI MC509 ...

Page 73: ...ids For any such problems consult your service provider Pacemaker manufacturers recommend that a minimum distance of 15 cm be maintained between the wireless device and a pacemaker to prevent potential interference with the pacemaker If you are using an electronic medical device consult the doctor or device manufacturer to confirm whether the radio wave affects the operation of this device 8 3 Are...

Page 74: ...e air bag inflates 8 5 Airline Security Observe the rules and regulations of airline companies When boarding or approaching a plane power off your wireless device Otherwise the radio signal of the wireless device may interfere with the plane control signals 8 6 Safety of Children Do not allow children to use the wireless device without guidance Small and sharp components of the wireless device may...

Page 75: ...smantle the wireless device or accessories Otherwise the wireless device and accessories are not covered by the warranty The device should be installed and operated with a minimum distance of 20 cm between the radiator and your body 8 11 Emergency Call This wireless device functions through receiving and transmitting radio signals Therefore the connection cannot be guaranteed in all conditions In ...

Page 76: ...C1_P MIC2_N MIC2_P NC NC NC NC NC NC PCM_CLK PCM_DIN PCM_DOUT PCM_SYNC NC NC NC NC NC NC RUIM_CLK RUIM_DATA NC RUIM_RESET RUIM_VCC NC NC NC NC SPKR_OUT_N SPKR_OUT_P UART_CTS UART_DCD UART_DSR UART_DTR UART_RING UART_RTS UART_RX UART_TX NC NC NC NC USB_DM USB_DP NC VBAT VBAT VCC_EXT1 VCC_EXT2 NC NC VCOIN WAKEUP_IN WAKEUP_OUT MISC Interface of MC509_MISC R109 20K C119 220pF C114 150U C121 22u C122 2...

Page 77: ...e System BB Baseband CDMA Code division Multiple Access CE European Conformity CS Coding Scheme CSD Circuit Switched Data DC Direct Current DCCH Dedicated Control Channel DCE Data Circuit terminating Equipment DMA Direct Memory Access DTE Data Terminal Equipment EACH Enhanced Access Channel EIA Electronic Industries Association EMC Electromagnetic Compatibility ESD Electrostatic Discharge EVDO Evo...

Page 78: ...ip Package NF Noise Figure NTC Negative Temperature Coefficient PBCCH Packet Broadcast Control Channel PCB Printed Circuit Board PCM Pulse Coded Modulation PCS Personal Communication System PDU Protocol Data Unit PLL Phase Lock Loop RF Radio Frequency RoHS Restriction of the use of certain Hazardous Substances RTC Real time Clock RUIM Removable User Identity Module Rx Receive SCH Supplemental Chan...

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