FusionModule1000B Water-Cooled IT Solution
Commissioning Guide
4 Preparations for Power-On Commissioning
Issue 02 (2017-01-10)
Huawei Proprietary and Confidential
Copyright © Huawei Technologies Co., Ltd.
13
Local Lowest Temperature
Recorded (°C)
Glycol Solution
Concentration
Power Density
Derating Coefficient
-20
40%
87.2%
-25
45%
85.5%
-30
49%
83.9%
-35
52%
82.7%
-40
55%
81.4%
4.5.3 Configuring Cooling Components
Prerequisites
External cooling components have been installed.
Preparations
Tools: ESD floor suction plate
Documents: cooling device layout diagram, air conditioner teamwork relationship diagram,
cooling component initial configuration table, pipe system diagram, pipe system valve control
relationship table
Skill requirement: cooling engineer
For the diagrams and tables, see the initial configuration parameter manual for the solution in use.
Context
Various valves are distributed in the Power Container, Equipment Container, Cooling
Container, and external pipeline of the FusionModule1000. Before operating the cooling
system, you must refer to
Table 4-9
Valve description
Name
Appearance
Common Position
Wafer
type
butterfly
valve
External pipes, Cooling
Container