2022.01
RF-21038
The specification and contents are subject to change without notice. Please check the latest document.
3
2. Outer contact soldering
Heat both a PCB pad and a connector contact
so that pour solder into a through hole properly.
GOOD
A through
hole(TH) is
fulfilled with
solder.
Defect
Lack of
solder
- Wave soldering condition
Preheat : max 100C / max 120sec
Solder : max 245C/ max 5sec
- Hand soldering condition
Preheat : max 100C / max 120sec
Solder iron : max 380C/ max 5sec
Note : reflow soldering can’t be
applied for this connector because of
outer shell swellings.
3. Center contact soldering
Around Dia0.3mm solder suits for center contact soldering.
Excessive soldering criteria
Solder should be in the pad area. Far
excessive solder could cause RF
performance.
Soldering at
bottom area
Soldering Criteria
Mounting and soldering procedure
Order 1. Positioning
⇒
2. Outer contact soldering
⇒
3. Center contact soldering
NOTE: A soldered connector must be used after cooled to the operating temperature.
Solder should be under the soldering
area. Far excessive solder could cause
RF performance.
