MF877-00 Page 2
Template Revision A
HPE instructions for this template are available at
Item Description
Notes
Quantity
of items
included
in product
Components, parts and materials containing
radioactive substances
0
2.0 Tools Required
List the type and size of the tools that would typically be used to disassemble the product to a point where components
and materials requiring selective treatment can be removed.
Tool Description
Tool Size (if
applicable)
Torx Driver
T15,T10
Phillips screw driver
PH1
Description #3
Description #4
Description #5
3.0 Product Disassembly Process
3.1 List the basic steps that should typically be followed to remove components and materials requiring selective treatment:
1. Remove HDD BP process
(1) Remove top cover and pull out the drawer, remove VRM top cover, unlock one thumbscrew on VRM module.
, Unlock two thumbscrew on cable chain and unplug one power cable and two SAS cables.
(2)Remove Pinch warning label and unlock 5 screws on Panel's two side.
(3)Remove LED cable.
(4)Remove IO module and press three bottom on both side and remove drawer.
(5)
Unlock 4 screw with Philip's head and unlock 20 screw HDD tray.
2. Remove FPLD board process
Remove LED cable and unlock 2 screws from FPLD board.
3. Remove VRM module process
(1)
Remove VRM top cover
(2)
Unlock one thumbscrew on VRM module.
(3)
Unlock 3 screws on Redriver board
4. Remove Redriver board process
(1) Remove Manage cable three connector.
(2) Unlock two thumbscrew, cut off cable tie and remove SAS cable connector.
5. Remove Power board process
(1)
Remove Manage cable,remove redriver board(Up) and metal bar.
(2)
Remove redriver board(Down) and unlock 6 screws from Power board.
6. Remove Power module process
(1)
Unlock 7 screws on I/O adapter top cover.
(2)
Unlock 3 screws on I/O adapter board.
Attachment 1- Remove Electrolytic CAP
Attachment 2- Remove Electrolytic CAP
3.2 Optional Graphic. If the disassembly process is complex, insert a graphic illustration below to identify the items
contained in the product that require selective treatment (with descriptions and arrows identifying locations).
