MF877-00 Page 2
Template Revision A
HPE instructions for this template are available at
Item Description
Notes
Quantity
of items
included
in product
Components, parts and materials containing
radioactive substances
0
2.0 Tools Required
List the type and size of the tools that would typically be used to disassemble the product to a point where components
and materials requiring selective treatment can be removed.
Tool Description
Tool Size (if
applicable)
Torx Driver
T10
Torx Driver
T15
Flat Head Screw Driver
Medium
Description #4
Description #5
3.0 Product Disassembly Process
3.1 List the basic steps that should typically be followed to remove components and materials requiring selective treatment:
1. System Board Battery -- Locate the battery on the system board. Push the lock area of battery holder and remove the
battery by hand.
2. System Megacell -- Remove the management module from system and locate megacell on the management board,
then remove the megacell and dispose of properly.
3. Capacitors>2.5 cm -- Remove the PSU from the system. With screw driver, remove the screws securing the top cover,
locate the capacitors and use a medium flat head screwdriver to remove them and dispose of properly.
4.
5.
6.
7.
8.
3.2 Optional Graphic. If the disassembly process is complex, insert a graphic illustration below to identify the items
contained in the product that require selective treatment (with descriptions and arrows identifying locations).
Attachment 1
Attachment 1 -- System Battery Location
Attachment 2 -- MEGACELL Location
Attachment 3~9 -- Super capacitor location by model number of power supply
