MF877-00 Page 2
Template Revision A
HPE instructions for this template are available at
MF877-01
Tool Description
Tool Size (if
applicable)
Phillips Screwdriver
P1 ,P2
Diagonal pliers
5
”
Socket Screwdriver
5.0mm ,5.5mm
3.0 Product Disassembly Process
3.1 List the basic steps that should typically be followed to remove components and materials requiring selective treatment:
1.
Using a P1 Phillips Screw Driver, remove all 14 screws securing top cover to chassis. Remove Cover. (see 3.2.1)
2.
Disconnect Power supply and main board cable connections (2 cables connections in all)
3.
Using a P2 Phillips Screw Driver, remove 4 screws to chassis ,remove Power supply(1pcs).(see 3.2.3)
4.
Disconnect PoE board and main board cable connections (2 cables connections in all) (see 3.2.4)
5.
Using a P2 Phillips Screw Driver, remove 4 screws to chassis ,remove Air baffle(1pcs) (see 3.2.5)
6.
Using a Socket Screw Driver (5.5mm), remove all 4 nuts to PoE Board and Disconnect PoE and main board cable connections (2
cables connections in all) (see 3.2.4) (see 3.2.6)
7.
Using a Socket Screw Driver (5.0mm), remove all 8 stand-off to chassis.(see 3.2.7)
8.
Disconnect Fan and main board 2 cable connections and Using a P2 Phillips Screw Driver, remove 4 screws to chassis, remove
Fan(2pcs) (see 3.2.8)
9.
Using a P2 Phillips Screw Driver, remove 15 screws to chassis ,remove main board (1pcs) and light-pipe (1pcs).(see 3.2.9)
10.
Cut ac-inlet materials (use
Diagonal pliers) and
Using a P2 Phillips Screw Driver, remove 1 screws to chassis and Disconnect
ac-inlet cable(see 3.2.10)
3.2 Optional Graphic. If the disassembly process is complex, insert a graphic illustration below to identify the items
contained in the product that require selective treatment (with descriptions and arrows identifying locations).
3.2.1
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