Acronyms and abbreviations
3DS TSV
three-dimensional stacked through-silicon via (integrated circuit packaging technology)
AOC
active optical cable
BMC
baseboard management controller
CAS
column address strobe
CSR
customer self repair
DAC
direct attach cable
DACC
direct attach copper cable
DDR4
double data rate-4
DHCP
dynamic host configuration protocol
EAC
EurAsian Conformity
EDR
enhanced data rate
EMI
electromagnetic interference
HPC
high performance computing
IPMI
Intelligent Platform Management Interface
KVM
keyboard, video and mouse
LFF
large form factor
LRDIMM
load reduced dual in-line memory module
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Acronyms and abbreviations