Cleanliness requirements
Dust buildup on the chassis might result in electrostatic adsorption, which causes poor contact of metal components and
contact points, especially when indoor relative humidity is low. In the worst case, electrostatic adsorption can cause
communication failure. The dust concentration limit s listed in
Dust concentration limit in the equipment room.
Table 2: Dust concentration limit in the equipment room
Substance
Concentration limit (particles/m
3
)
Dust
≤ 3 x 10
4
(no visible dust on the tabletop over three days)
NOTE: Dust diameter ≥
5 μ
m
The equipment room must also meet limits on salts, acids, and sulfides to eliminate corrosion and premature aging of
components, as shown in
Harmful gas limits in the equipment room.
Table 3: Harmful gas limits in the equipment room
Gas
Chemical formula
Maximum concentration (mg/m
3
)
Sulfur dioxide
SO
2
0.2
Hydrogen sulfide
H
2
S
0.006
Ammonia
NH
3
0.05
Chlorine
Cl
2
0.01
EMI requirements
All electromagnetic interference (EMI) sources, from outside or inside of the switch and application system, adversely affect
the switch in the following ways:
• A conduction pattern of capacitance coupling.
• Inductance coupling.
• Electromagnetic wave radiation.
• Common impedance (including the grounding system) coupling.
To prevent EMI, use the following guidelines:
• If AC power is used, use a single-phase three-wire power receptacle with protection earth (PE) to filter interference from
the power grid.
• Keep the switch far away from radio transmitting stations, radar stations, and high-frequency devices.
• Use electromagnetic shielding, for example, shielded interface cables, when necessary.
Laser safety requirements
WARNING: Do not stare into any fiber port when the switch has power. The laser light emitted from the optical fiber
might hurt your eyes.
The switch is a Class 1 laser device.
Preparation for installation
9
