EL-MF877-00 Page 2
Template Revision A
2.0 Tools Required
List the type and size of the tools that would typically be used to disassemble the product to a point where components
and materials requiring selective treatment can be removed.
Tool Description
Tool Size (if
applicable)
Description #1: Phillips screwdriver
Description #2: Diagonal cutting plier
Description #3 Nipper
3.0 Product Disassembly Process
3.1 List the basic steps that should typically be followed to remove components and materials requiring selective treatment:
1. Remove chassis labels on label mylar tab
2. Remove chassis rubber and screws
3. Remove upper plastic and metal chassis
4. Remove EMI contact fingers and heatsink EMI gasket from the upper metal chassis
5. Remove light shielding rubber from the upper plastic chassis
6. Separate upper metal chassis from upper plastic chassis
7. Separate PCBA board from the chassis using the screwdriver
8. Separate lower metal chassis from lower plastic chassis
9. Remove label mylar tab
3.2 Optional Graphic. If the disassembly process is complex, insert a graphic illustration below to identify the items
contained in the product that require selective treatment (with descriptions and arrows identifying locations).
