EL-MF877-00 Page 2
Template Revision A
2.0 Tools Required
List the type and size of the tools that would typically be used to disassemble the product to a point where components
and materials requiring selective treatment can be removed.
Tool Description
Tool Size (if
applicable)
Description #1 screw driver
Philip #1 /
TORX T
Description #2 screw driver
Philip #0 /
TORX T
Description #3
Description #4
Description #5
3.0 Product Disassembly Process
3.1 List the basic steps that should typically be followed to remove components and materials requiring selective treatment:
1. remove log low
2. remove battery pack
3. remove LCD Module
4. remove Front Speaker
5. remove DC_IN & Cable and I/O Board
6. remove HDD Module
7. remove Thermal Module
8. remove Card Module
9. remove MB
10. remove Rear Speaker
11. remove TP LED Board
12. remove TP Module
13. remove Antenna
14. remove Power Board
15. remove KB support Brk
16. remove KB
17. remove ESD PCB
18. divide Display assy (remove LCD Bezel)
19. divide Display assy (remove LCD Hinge Cap L-R)
20. divide Display assy (remove LCD module)
21. divide Display assy (remove LCD Hinge Brk L-R)
22. divide Display assy (remove LVDS Cable & control board cable)
23. divide M/B assy (remove Rj45 Door ASSY)
24. divide M/B assy (remove Shielding can ASSY_TOP)
25. divide MB assy (remove RTC Battery)
26. divide MB assy (Shielding can ASSY_BTM)
27. divide Display assy (remove LCD cover AL skin)
28. divide Log UP assy(remove Log up AL skin)
3.2 Optional Graphic. If the disassembly process is complex, insert a graphic illustration below to identify the items
contained in the product that require selective treatment (with descriptions and arrows identifying locations).
