HP S2032a, Disassembly Instructions Manual

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EL-MF877-00 Page 2
Template Revision A
Components, parts and materials containing
radioactive substances
0
2.0 Tools Required
List the type and size of the tools that would typically be used to disassemble the product to a point where components
and materials requiring selective treatment can be removed.
Tool Description Tool Size (if
applicable)
Description #1 SCREW DRIVER(PHILLIPS HEAD) #2
Description #2
Description #3
Description #4
Description #5
3.0 Product Disassembly Process
3.1 List the basic steps that should typically be followed to remove components and materials requiring selective treatment:
1. External Electric Cables Dissecting Process
2. Remove Stand Base From Display Head
3. Remove Rear Cover From Display Head
4. Remove Front Cover From Display Head
5. Remove Key Board Off From Front Cover
6. Take Screw(x9)Off From Chassis Cover
7. Remove Interface BD and Power BD From Chassis
8. Explode Stand Base
9. Take Screw(x3) Off From P.C.B
10. LCD PANEL EXPLODE
11. Electrolytic Capacitors Over 25mm High& Diameter Dissecting Process
12. Electrolytic Capacitors Process Drawing
3.2 Optional Graphic. If the disassembly process is complex, insert a graphic illustration below to identify the items
contained in the product that require selective treatment (with descriptions and arrows identifying locations).