EL-MF877-00 Page 2
Template Revision C
Last revalidation date 04-01-2018
HPI instructions for this template are available at
EL-MF877-01
Item Description
Notes
Quantity of
items
included in
product
Components and parts containing toner and ink, including
liquids, semi-liquids (gel/paste) and toner
Include the cartridges, print heads, tubes, vent chambers, and
service stations.
0
Components and waste containing asbestos
0
Components, parts and materials containing refractory ceramic
fibers
0
Components, parts and materials containing radioactive
substances
0
2.0 Tools Required
List the type and size of the tools that would typically be used to disassemble the product to a point where components and materials requiring
selective treatment can be removed.
Tool Description
Tool Size (if
applicable)
Star screwdriver
T15 slot
Cross screwdrive
Phillip #1
3.0 Product Disassembly Process
3.1 List the basic steps that should typically be followed to remove components and materials requiring selective treatment including the required steps
to remove the external enclosure:
1.
Remove Top cover
2.
Remove ODD & cable
3.
3.Remove frove bezel
4.
Open cage & remove cable form MB
5.
Remove storage (3.5
”
HDD or 2.5
”
HDD) cad cable
6.
6.Remove Card reader module
7.
Remove WLAN module
8.
Remove speaker
9.
9.Remove DIMM
10.
Remove add-on card
11.
Remove hood sensor and fan duct
12.
Remove Cooler & CPU
13.
Remove antenna
14.
Remove flex I/O board
15.
Remove MB & PSU
3.2 Optional Graphic. If the disassembly process is complex, insert a graphic illustration below to identify the items contained in the product that
require selective treatment (with descriptions and arrows identifying locations).
