Components, parts and materials containing
radioactive substances
0
2.0 Tools Required
List the type and size of the tools that would typically be used to disassemble the product to a point where components
and materials requiring selective treatment can be removed.
Tool Description
Tool Size (if
applicable)
Description Screwdriver
#1#2
Description #2
Description #3
Description #4
Description #5
3.0 Product Disassembly Process
3.1 List the basic steps that should typically be followed to remove components and materials requiring selective treatment:
1. Release hinge BTN and Pull up Slate.fig#1
2. Disassemblly Slate Cover.fig#2
3. Release bootm trim's screw and disasemblly bottom trim.fig#3
4. Release Thermal bracket's screw and disasemblly Thermal bracket.fig#4
5. Disasemblly Speaker fig#5
6. Release MB's screw and disasemblly MB.fig#6
7. Release Battery's screw and disasemblly Battery.fig#7
8. Slate disasemblly finish.fig#8
9. Remove Base Rubber foot.fig#9
10. Release Base's screw and disasemblly Base case.fig#10
11. Release Hinge's cable and screw and disasemblly Hinge module.fig#11
12. Release Battery's screw and disasemblly Battery.fig#12
13. Release all board's screw and disasemblly all board.fig#13
14. Dock disaemblly finish.fig#14
3.2 Optional Graphic. If the disassembly process is complex, insert a graphic illustration below to identify the items
contained in the product that require selective treatment (with descriptions and arrows identifying locations).
1. Release hinge BTN and Pull up Slate
2. Disassemblly Slate Cover
EL-MF877-00 Page 2
Template Revision B
PSG instructions for this template are available at
EL-MF877-01
