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EL-MF877-00                                                Page 2 
Template Revision C  

Last revalidation date 09-May-2018 

                 

 

 

 

 

  

HPI instructions for this template are available at 

EL-MF877-01

  

Item Description 

Notes 

Quantity of 
items 
included in 
product 

already listed as a separate item above)  
Components and parts containing toner and ink, 
including liquids, semi-liquids (gel/paste) and toner 

Include the cartridges, print heads, tubes, vent 
chambers, and service stations.             

Components and waste containing asbestos 

            

Components, parts and materials containing 
refractory ceramic fibers 

            

Components, parts and materials containing 
radioactive substances 

            

2.0 Tools Required 

List the type and size of the tools that would typically be used to disassemble the product to a point where components and 
materials requiring selective treatment can be removed. 

Tool Description 

Tool Size (if 
applicable) 

Screw driver of "+" type

 

200mm 

Hexagonal nut screw driver for DVI  and D-SUB connector

 

200mm 

Scraper 

           

           

           

           

           

3.0 Product Disassembly Process 

3.1 List the basic steps that should typically be followed to remove components and materials requiring selective treatment 
including the required steps to remove the external enclosure:  

 

1.

 

Lay the monitor on a flat, soft and clean surface. (NOTE: The model using the curved surface screen, avoid crack) 

2.

 

Remove the screws by screw driver, to remove base; and then stand. 

3.

 

Use scraper to open all the latches along the edge of the Rear Cover; 

4.

 

Lift the Rear Cover and disconnect the connector to remove the Rear Cover  

5.

 

 

6.

 

 

7.

 

 

8.

 

 

9.

 

 

10.

 

Separate the panel, bezel and rear cover.

 

 

 

3.2 Optional Graphic.  If the disassembly process is complex, insert a graphic illustration below to identify the items contained 
in the product that require selective treatment (with descriptions and arrows identifying locations).

 

Summary of Contents for P27q G4

Page 1: ... applicable Item Description Notes Quantity of items included in product Printed Circuit Boards PCB or Printed Circuit Assemblies PCA With a surface greater than 10 sq cm Main Board Power Board Key Board 3 Batteries excluding Li Ion batteries All types including standard alkaline coin or button style batteries 0 Li Ion batteries Include all Li Ion batteries if more than one is provided with the pr...

Page 2: ...ent can be removed Tool Description Tool Size if applicable Screw driver of type 200mm Hexagonal nut screw driver for DVI and D SUB connector 200mm Scraper 3 0 Product Disassembly Process 3 1 List the basic steps that should typically be followed to remove components and materials requiring selective treatment including the required steps to remove the external enclosure 1 Lay the monitor on a fla...

Page 3: ...a flat soft and clean surface Remove the screws to remove the stand base assy Remove the rear cover Remove the rear cover Disconnect the cable and the tape Disconnect the cable and the tape Disconnect the tapes and remove the screws Remove the Led Board Disconnect the tapes and remove the screws Remove the LED Board ...

Page 4: ...emove the screws and disconnect the pins Remove the screws and disconnect the pins Remove the main board and the power board Remove the mylar remove the screws to remove the main board and the power board ...

Page 5: ...3 Disconnect the pins Disconnect the pins The Mainframe The Mainframe ...

Page 6: ...4 Remove the screws to remove the key board Remove the screws to remove the key board The Rear Cover The Rear Cover ...

Page 7: ...5 The panel and the bezel The panel and the Bezel ...

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