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EL-MF877-00                                                                                              Page  2 
Template Revision B  

 

 

 

 

PSG instructions for this template are available at 

EL-MF877-01

 

Components and parts containing toner and ink, 
including liquids, semi-liquids (gel/paste) and toner 

Include the cartridges, print heads, tubes, vent 
chambers, and service stations.           

Components and waste containing asbestos 

            

Components, parts and materials containing 
refractory ceramic fibers 

            

Components, parts and materials containing 
radioactive substances 

            

2.0 Tools Required

 

List the type and size of the tools that would typically be used to disassemble the product to a point where components 
and materials requiring selective treatment can be removed. 

Tool Description 

Tool Size (if 
applicable) 

Screw driver 

Ph2/Ph00 

Disassembly Tool  

           

Bolt sleeve 

           

           

           

           

           

3.0 Product Disassembly Process

 

3.1 List the basic steps that should typically be followed to remove components and materials requiring selective treatment:  

1.   Lay the display on desk, separate Stand from display Head.  
2.  Unscrew Back Cover, unhook Bucket from Bezel. 
3.  Remove the accessories(Tape, Al Foil, etc), disconnect some terminals. 
4.   Take out Chassis and Panel. 
5.   Unscrew Power and IF board, take them out and disconnect the terminals 
6.   Peel off mylars from Chassis 
7.              
8.              
9.              
10.              

3.2 Optional Graphic.  If the disassembly process is complex, insert a graphic illustration below to identify the items 
contained in the product that require selective treatment (with descriptions and arrows identifying locations).

 
 
 

Summary of Contents for P204

Page 1: ... as applicable Item Description Notes Quantity of items included in product Printed Circuit Boards PCB or Printed Circuit Assemblies PCA With a surface greater than 10 sqcm IF board 1 KP board 1 Power board 1 3 Batteries All types including standard alkaline and lithium coin or button style batteries 0 Mercury containing components For example mercury in lamps display backlights scanner lamps swit...

Page 2: ...selective treatment can be removed Tool Description Tool Size if applicable Screw driver Ph2 Ph00 Disassembly Tool Bolt sleeve 3 0 Product Disassembly Process 3 1 List the basic steps that should typically be followed to remove components and materials requiring selective treatment 1 Lay the display on desk separate Stand from display Head 2 Unscrew Back Cover unhook Bucket from Bezel 3 Remove the...

Page 3: ...HP P204 disassembly introduction ...

Page 4: ...e hang on the stand Step 2 Push the Quick Release Button with one finger or stick the another hand pull the stand out at same time Step 3 Push the Quick Release Button and separate stand arm from stand base Step 4 Unscrew 4 VESA screws M4 10 ...

Page 5: ...suggested sequence is from repair slot as picture show in a counterclockwise direction Step 6 Separate Bucket from Bezel slightly DO NOT move Bucket away directly Step 7 Turn over Bucket and disconnect the terminal Step 8 Peel off the cable from Bucket ...

Page 6: ...Step 9 Unscrew 2 screws T2 4 Step 10 Take out keypad from right side Step 11 Peel off all Al foils and Tapes Step 12 Disconnect the terminals ...

Page 7: ...Step 13 Take out Chassis and Panel Step 14 The Rubber is detachable Step 15 Take away the mylar Step 16 Unscrew 5 pan screws M3 6 1 GND screw M4 9 and 2 bolts ...

Page 8: ...Step 17 Take out Power and IF board Step 18 Disconnect the terminals Step 19 Power and IF board as picture show Step 20 Peel off the mylars ...

Page 9: ......

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