HP OMEN 17 Product End-Of-Life Disassembly Instructions Download Page 1

EL-MF877-00                                                Page 1 
Template Revision C  

Last revalidation date 09-May-2018 

                 

 

 

 

 

  

HPI instructions for this template are available at 

EL-MF877-01

  

                 

 

Product End-of-Life Disassembly Instructions 

Product Category: External Options

 

Marketing Name / Model 
[List multiple models if applicable.] 

OMEN by HP 17 Laptop PC

 

OMEN by HP Laptop 

OMEN by HP Laptop 17 

 

 

Purpose: The document is intended for use by end-of-life recyclers or treatment facilities. It provides the basic instructions for 
the disassembly of HPI products to remove components and materials requiring selective treatment, as defined by EU directive 
2012/19/EC, Waste Electrical and Electronic Equipment (WEEE). 
 
NOTE: Recyclers should sort plastic materials into resin streams for recycling based on the ISO 11469 plastic marking code on 
the plastic part. For any questions on plastic marking, please contac

HP’s Sustainability Contact

.    

1.0 Items Requiring Selective Treatment

 

1.1 Items listed below are classified as requiring selective treatment. 
1.2 Enter the quantity of items contained within the product which require selective treatment in the right column, as 
applicable. 

Item Description 

Notes 

Quantity of 
items 
included in 
product 

Printed Circuit Boards (PCB) or Printed Circuit 
Assemblies (PCA) 

With a surface greater than 10 sq cm 
 

Batteries, excluding Li-Ion batteries. 

All types including standard alkaline, coin or button 
style batteries   

Li-Ion batteries.  Include all Li-Ion batteries if more 
than one is provided with the product (such as a 
detachable notebook keyboard battery, RTC coin cell, 
etc.) 

Battery(ies) are attached to the product by (

check all 

that apply with an

 “x” 

inside the

 “[ ]”): 

[4] screws 
[0] snaps 
[0] adhesive 
[          ] other.  Explain            
NOTE: Add detailed removal procedures including 
required tools in the sections 3.1 and 3.2. 

Mercury-containing components 

For example, mercury in lamps, display backlights, 
scanner lamps, switches, batteries             

           

Liquid Crystal Displays (LCD) with a surface greater 
than 100 sq cm 

Includes background illuminated displays with gas 
discharge lamps             

Cathode Ray Tubes (CRT) 

            

           

Capacitors / condensers (Containing PCB/PCT) 

            

           

Electrolytic Capacitors / Condensers measuring 

            

           

Summary of Contents for OMEN 17

Page 1: ...quiring selective treatment 1 2 Enter the quantity of items contained within the product which require selective treatment in the right column as applicable Item Description Notes Quantity of items included in product Printed Circuit Boards PCB or Printed Circuit Assemblies PCA With a surface greater than 10 sq cm 1 Batteries excluding Li Ion batteries All types including standard alkaline coin or...

Page 2: ...s containing refractory ceramic fibers Components parts and materials containing radioactive substances 2 0 Tools Required List the type and size of the tools that would typically be used to disassemble the product to a point where components and materials requiring selective treatment can be removed Tool Description Tool Size if applicable 3 0 Product Disassembly Process 3 1 List the basic steps ...

Page 3: ...tional Graphic If the disassembly process is complex insert a graphic illustration below to identify the items contained in the product that require selective treatment with descriptions and arrows identifying locations step 1 remove lower step 2 remove battery step 3 remove HDD step 4 remove bracket and DC in cable step 5 remove thermal module ...

Page 4: ...st revalidation date 09 May 2018 HPI instructions for this template are available at EL MF877 01 step 6 remove IO B step 7 remove wlan card SSD bracket SSD module step 8 remove MB step 9 remove Power B Sensor B step 10 remove speaker TP button ...

Page 5: ...e Revision C Last revalidation date 09 May 2018 HPI instructions for this template are available at EL MF877 01 step 11 remove hinge up step 12 remove Bezel step 13 remove hinge step 14 reomve panel step 15 reomve panel bracket ...

Page 6: ...EL MF877 00 Page 6 Template Revision C Last revalidation date 09 May 2018 HPI instructions for this template are available at EL MF877 01 step 16 reomve antenna camera module ...

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