EL-MF877-00 Page 2
Template Revision C
Last revalidation date 09-September-2019
HPI instructions for this template are available at
Item Description
Notes
Quantity of
items
included in
product
Plastics containing Brominated Flame Retardants
weighing > 25 grams (not including PCBs or PCAs
already listed as a separate item above)
0
Components and parts containing toner and ink,
including liquids, semi-liquids (gel/paste) and toner
Include the cartridges, print heads, tubes, vent
chambers, and service stations.
0
Components and waste containing asbestos
0
Components, parts and materials containing
refractory ceramic fibers
0
Components, parts and materials containing
radioactive substances
0
2.0 Tools Required
List the type and size of the tools that would typically be used to disassemble the product to a point where components and
materials requiring selective treatment can be removed.
Tool Description
Tool Size (if
applicable)
Screwdriver
2
Slothead screwdriver
1
3.0 Product Disassembly Process
3.1 List the basic steps that should typically be followed to remove components and materials requiring selective treatment
including the required steps to remove the external enclosure:
1.
Lay the display on soft desk and push the button of stand to unlock the stand, then pull out the stand form the monitor
head.
2.
Twist out the screw and separate base and stand.
3.
Move rear cover follow the below way.
4.
Remove two acetate cloth tape and pull out the LED/30pin ffc cable
5.
Remove the rear support thirteen screws ,hinge four screws ,MB three screws
6.
Remove deco from the monitor.
3.2 Optional Graphic. If the disassembly process is complex, insert a graphic illustration below to identify the items contained
in the product that require selective treatment (with descriptions and arrows identifying locations).
