EL-MF877-00 Page 2
Template Revision C
Last revalidation date 09-May-2018
HPI instructions for this template are available at
EL-MF877-01
Item Description
Notes
Quantity of
items
included in
product
cord*1
Gas Discharge Lamps
0
Plastics containing Brominated Flame Retardants
weighing > 25 grams (not including PCBs or PCAs
already listed as a separate item above)
0
Components and parts containing toner and ink,
including liquids, semi-liquids (gel/paste) and toner
Include the cartridges, print heads, tubes, vent
chambers, and service stations.
0
Components and waste containing asbestos
0
Components, parts and materials containing
refractory ceramic fibers
0
Components, parts and materials containing
radioactive substances
0
2.0 Tools Required
List the type and size of the tools that would typically be used to disassemble the product to a point where components and
materials requiring selective treatment can be removed.
Tool Description
Tool Size (if
applicable)
Screwdriver
2
Slothead screwdriver
1
3.0 Product Disassembly Process
3.1 List the basic steps that should typically be followed to remove components and materials requiring selective treatment
including the required steps to remove the external enclosure:
1.
Push the button of stand to unlock the stand, then pull out the stand form the monitor head.
2.
Use screwdriver to separate the RC from the monitor head through the tear down slots which on the bottom side.
3.
Remove the adhesive tape on the panel and unlock the back light wire*1 and LVDS*1 from the panel.
4.
Disconnect FFC*1 from the interface board.
5.
Pull out the control board and privacy board from the mid frame by hand.
6.
Remove screws *9 on the panel and mid frame and screw*1 on the usb board.
7.
Disconnect FFC from the board
8.
Remove the mylar from the SHD
9.
Remove screws *7 on the power board and interface board
10.
Disconnect the wire to separate power board and interface board
11.
Disconnect the LVDS from interface board.
12.
Disconnect the wire from power board.
