2.0 Tools Required
List the type and size of the tools that would typically be used to disassemble the product to a point where components
and materials requiring selective treatment can be removed.
Tool Description
Tool Size (if
applicable)
Description #1 Screw driver of "+" type
Description #2 Hexagonal nut screw driver for DVI and D-SUB connector
Description #3
Description #4
Description #5
3.0 Product Disassembly Process
3.1 List the basic steps that should typically be followed to remove components and materials requiring selective treatment:
1. Remove the rear cover
2. Remove the the tapes and the pins.
3. Remove the screws to remove the shield_mainboard.
4. Remove the pins
5. Remove the screws
6. Remove the screws and the tapes to remove the mainframe
7. Remove the Mainframe and the pins.
8. Remove the The mainframe
9.
10.
