EL-MF877-00 Page 2
Template Revision B
PSG instructions for this template are available at
Components, parts and materials containing
radioactive substances
0
2.0 Tools Required
List the type and size of the tools that would typically be used to disassemble the product to a point where components
and materials requiring selective treatment can be removed.
Tool Description
Tool Size (if
applicable)
Description #1
Description #2
Description #3
Description #4
Description #5
3.0 Product Disassembly Process
3.1 List the basic steps that should typically be followed to remove components and materials requiring selective treatment:
1. Remove access panel
2. Remove HDD and HDD FAN for Dolomite and Hood Sensor
3. Remove system fan
4. Remove heat sink from M/B
5. Remove WLAN Card from M/B
6. Remove ambient sensor fly cable and Speaker cable
7. Remove M/B and battery
8. Remove Memory
9.
Remove Rear IO (HDMI/DP/SERIAL) card and M.2 card
10. Remove front bezel
3.2 Optional Graphic. If the disassembly process is complex, insert a graphic illustration below to identify the items
contained in the product that require selective treatment (with descriptions and arrows identifying locations).
