The Molded Pulp packaging material is made from 70% recycled
content
HP follows these guidelines to decrease the environmental impact of product
packaging:
Eliminate the use of heavy metals such as lead, chromium, mercury and
cadmium in packaging materials.
Eliminate the use of ozone-depleting substances (ODS) in packaging
materials.
Design packaging materials for ease of disassembly.
Maximize the use of post-consumer recycled content materials in
packaging materials.
Use readily recyclable packaging materials such as paper and
corrugated materials.
Reduce size and weight of packages to improve transportation fuel
efficiency.
Plastic packaging materials are marked according to ISO 11469 and DIN
6120 standards.
Material Usage
This product does not contain any of the following substances in excess of
regulatory limits (for reference of these limits please refer to the HP General
Specification of the Environment:
(
http://www.hp.com/hpinfo/globalcitizenship/environment/supplychain/
gen_specifications.html
):
Asbestos
Certain Azo Colorants
Certain Brominated Flame Retardants – may not be used as flame
retardants in plastics
Cadmium
Chlorinated Hydrocarbons
Chlorinated Paraffins
Formaldehyde
Halogenated Diphenyl Methanes
Lead carbonates and sulfates
Lead and Lead compounds
Mercuric Oxide Batteries
Ozone Depleting Substances
Polybrominated Biphenyls (PBBs)
Polybrominated Biphenyl Ethers (PBBEs)
Polybrominated Biphenyl Oxides (PBBOs)
Polychlorinated Biphenyl (PCB)
Polychlorinated Terphenyls (PCT)
Polyvinyl Chloride (PVC) – except for wires and cables, and certain retail
packaging has been voluntarily removed from most applications.
Radioactive Substances
Tributyl Tin (TBT), Triphenyl Tin (TPT), Tributyl Tin Oxide (TBTO)
Nickel finishes that release greater than 0.5 µgrams/cm2/week,
measured according to EN 1811:1998, are not used on any product
surface designed to be frequently handled or touched by users.
End-of-life Management
Hewlett-Packard offers end-of-life HP product return and recycling programs
QuickSpecs
HP EliteBook 8760w Mobile Workstation
Technical Specifications
DA - 14000 Worldwide — Version 14 — August 3, 2012
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